公开(公告)号：US10109921B2

公开(公告)日：2018-10-23

申请号：US15270154

申请日：2016-09-20

Applicant: Intel IP Corporation

Inventor： Alfonso Munoz-Acevedo ,  Pablo Herrero

IPC: H04B17/00 ,  H01Q9/04 ,  H03H7/40 ,  H04B17/12 ,  H04B17/19 ,  H01Q1/24

Abstract: A self-calibrating antenna system having a radio frequency (RF) detector configured to estimate a time delay of a transmission signal on a transmission line, which couples an RF front end with an antenna tuner, based on a magnitude and phase of an input impedance of the transmission line at a first set of a plurality of respective frequencies, and a transceiver configured to transmit to the antenna tuner a calibrated tuning control command based on the estimated time delay to calibrate the antenna tuner and the transmission line.

公开(公告)号：US20170054215A1

公开(公告)日：2017-02-23

申请号：US15270154

申请日：2016-09-20

Applicant: Intel IP Corporation

Inventor： Alfonso Munoz-Acevedo ,  Pablo Herrero

IPC: H01Q9/04 ,  H04B17/19 ,  H01Q1/24 ,  H04B17/12

CPC classification number: H01Q9/0442 ,  H01Q1/242 ,  H03H7/40 ,  H04B17/12 ,  H04B17/19

Abstract: A self-calibrating antenna system having a radio frequency (RF) detector configured to estimate a time delay of a transmission signal on a transmission line, which couples an RF front end with an antenna tuner, based on a magnitude and phase of an input impedance of the transmission line at a first set of a plurality of respective frequencies, and a transceiver configured to transmit to the antenna tuner a calibrated tuning control command based on the estimated time delay to calibrate the antenna tuner and the transmission line.

Abstract translation: 一种自校准天线系统，其具有射频（RF）检测器，其被配置为基于输入阻抗的幅度和相位估计将RF前端与天线调谐器耦合的传输线上的传输信号的时间延迟 以及收发器，被配置为基于估计的时间延迟向天线调谐器发送校准的调谐控制命令，以校准天线调谐器和传输线。

公开(公告)号：US08779564B1

公开(公告)日：2014-07-15

申请号：US13803143

申请日：2013-03-14

Applicant: Intel IP Corporation

Inventor： Mikael Knudsen ,  Thorsten Meyer ,  Saravana Maruthamuthu ,  Andreas Wolter ,  Georg Seidemann ,  Pablo Herrero ,  Pauli Jaervinen

IPC: H01L23/552 ,  H01L27/06

CPC classification number: H01L23/552 ,  H01L23/295 ,  H01L23/48 ,  H01L23/66 ,  H01L24/19 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2223/6688 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01Q1/2283 ,  H01Q9/0414 ,  H01Q9/0421 ,  H01Q23/00 ,  H01L2924/00

Abstract: A semiconductor device may include: a chip; a chip packaging structure at least partially surrounding the chip and having a receiving region configured to receive a first capacitive coupling structure; a first capacitive coupling structure disposed in the receiving region; and a second capacitive coupling structure disposed over the first capacitive coupling structure and capacitively coupled to the first capacitive coupling structure.

Abstract translation: 半导体器件可以包括：芯片; 芯片封装结构至少部分地围绕芯片并且具有被配置为接收第一电容耦合结构的接收区域; 设置在所述接收区域中的第一电容耦合结构; 以及设置在所述第一电容耦合结构上并且电容耦合到所述第一电容耦合结构的第二电容耦合结构。