公开(公告)号：US10779402B1

公开(公告)日：2020-09-15

申请号：US16402992

申请日：2019-05-03

申请人： Intel Corporation

发明人： Kai Chong Ng ,  Natasya Athirah Abdul Khalid ,  Florence Su Sin Phun ,  Yee Hung See Tau ,  Asmah Truky ,  Ying Ern Ho

IPC分类号： H05K1/02 ,  H01L23/498 ,  G06F1/10

摘要： A printed circuit board (PCB) includes a dielectric plane and a ground plane parallel to and spaced apart from the dielectric plane. The dielectric plane includes a pair of signal traces and a 3-dimensional (3D) grounded (GND) fence located between the pair of signal traces. The 3D GND fence is electrically connected to the ground plane, and protrudes perpendicularly from the dielectric plane. The 3D GND fence is located equidistant from each of the pair of signal traces, and the 3D GND fence is configured to block electromagnetic interference (EMI) from a first of the pair of signal traces to a second of the pair of the signal traces. The pair of signal traces is configured to form part of a noise-sensitive electronic circuit. The 3D GND fence may have a rectangular configuration.