公开(公告)号：US20220308294A1

公开(公告)日：2022-09-29

申请号：US17214035

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Wesley MORGAN ,  Srikant NEKKANTY ,  Todd R. COONS ,  Gregorio R. MURTAGIAN ,  Xiaoqian LI ,  Nitin DESHPANDE ,  Divya PRATAP

IPC: G02B6/42

Abstract: Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.

公开(公告)号：US20220196943A1

公开(公告)日：2022-06-23

申请号：US17131621

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Xiaoqian LI ,  Nitin DESHPANDE ,  Omkar KARHADE ,  Ravindranath V. MAHAJAN

IPC: G02B6/42 ,  H01L25/16 ,  H01L23/00 ,  H01L23/367

Abstract: A semiconductor package comprises an interposer and a photonics die. The photonics die has a front side with an on-chip fiber connector and solder bumps, the photonics die over the interposer with the on-chip fiber connector and the solder bumps facing away from the interposer. A patch substrate is mounted on the interposer adjacent to the photonics die. A logic die is mounted on the patch substrate with an overhang past an edge of the patch substrate and the overhang is attached to the solder bumps of the photonics die. An integrated heat spreader (IHS) is over the logic die such that the photonics die does not directly contact the IHS.

公开(公告)号：US20220196935A1

公开(公告)日：2022-06-23

申请号：US17131682

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Xiaoqian LI ,  Nitin DESHPANDE ,  Omkar KARHADE ,  Asako TODA ,  Divya PRATAP ,  Zhichao ZHANG

IPC: G02B6/42

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package comprises a package substrate, and a compute die over the package substrate. In an embodiment, a photonics die is also over the package substrate, and the photonics die overhangs an edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the photonics die, and a fiber connector is coupled to the photonics die. In an embodiment, the fiber connector is attached to the IHS

公开(公告)号：US20220196936A1

公开(公告)日：2022-06-23

申请号：US17132967

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Kaveh HOSSEINI ,  Xiaoqian LI ,  Conor O'KEEFFE ,  Jing FANG ,  Kevin P. MA ,  Shamsul ABEDIN

IPC: G02B6/42 ,  H01L21/66

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to a bidirectional optical grating coupler that may be used for testing. A photonic apparatus includes a first layer with electro-optical circuitry that is optically coupled with a bidirectional optical grating coupler. A second layer is physically coupled with a first side of the first layer and includes a first light path to optically coupled with the bidirectional optical grating coupler. A third layer is physically coupled with a second side of the first layer opposite the first side of the first layer, and includes a second light path that optically couples with the bidirectional grating coupler. Operational testing of the electro-optical circuitry is based in part on light received or transmitted through the second light path. Other embodiments may be described and/or claimed.

公开(公告)号：US20250038163A1

公开(公告)日：2025-01-30

申请号：US18917500

申请日：2024-10-16

Applicant: Intel Corporation

Inventor： Zhichao ZHANG ,  Kemal AYGÜN ,  Suresh V. POTHUKUCHI ,  Xiaoqian LI ,  Omkar KARHADE

IPC: H01L25/18 ,  G02B6/42 ,  H01L23/373 ,  H01L23/538 ,  H01L25/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to disaggregating co-packaged SOC and photonic integrated circuits on an multichip package. The photonic integrated circuits may also be silicon photonics engines. In embodiments, multiple SOCs and photonic integrated circuits may be electrically coupled, respectively, into modules, with multiple modules then incorporated into an MCP using a stacked die structure. Other embodiments may be described and/or claimed.

公开(公告)号：US20220310566A1

公开(公告)日：2022-09-29

申请号：US17214083

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Xiaoqian LI ,  Wei LI ,  Santosh SHAW ,  Jingyi HUANG

IPC: H01L25/075 ,  H01L33/62 ,  G02B6/42 ,  G02B6/12 ,  H01L33/58

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package includes a photonics die and a plurality of v-grooves on the photonics die. A barrier structure proximate the plurality of v-grooves.

公开(公告)号：US20220196941A1

公开(公告)日：2022-06-23

申请号：US17125481

申请日：2020-12-17

Applicant: Intel Corporation

Inventor： Asako TODA ,  Chia-Pin CHIU ,  Xiaoqian LI ,  Yiqun BAI

IPC: G02B6/42

Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, where the package substrate comprises a recessed edge. In an embodiment, a compute die is on the package substrate, and an optics die on the package substrate and overhanging the recessed edge of the package substrate. In an embodiment, an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, a lid covers the recess in the package substrate

公开(公告)号：US20220196931A1

公开(公告)日：2022-06-23

申请号：US17131597

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Xiaoqian LI ,  Nitin DESHPANDE ,  Omkar KARHADE

IPC: G02B6/42

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques for coupling a micro-lens array to a photonics die. In embodiments, this coupling may be performed as an attach at a wafer level. In embodiments, wafer level optical testing of the photonics die with the attached micro-lens array may be tested electrically and optically before the photonics die is assembled into a package, in various configurations. Other embodiments may be described and/or claimed.

公开(公告)号：US20210405311A1

公开(公告)日：2021-12-30

申请号：US16911764

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Xiaoqian LI ,  Nitin DESHPANDE ,  Omkar KARHADE

IPC: G02B6/42 ,  G02B6/43

Abstract: Embodiments disclosed herein include electronic packages with photonics modules. In an embodiment, a photonics module comprises a carrier substrate and a photonics die over the carrier substrate. In an embodiment, the photonics die has a first surface facing away from the carrier substrate and a second surface facing the carrier substrate, and a plurality of V-grooves are disposed on the first surface proximate to an edge of the photonics die. In an embodiment, the photonics module further comprises a fiber connector attached to the photonics die, where the fiber connector couples a plurality of optical fibers to the photonics die. In an embodiment, individual ones of the plurality of optical fibers are positioned in the V-grooves.

公开(公告)号：US20200076046A1

公开(公告)日：2020-03-05

申请号：US16122609

申请日：2018-09-05

Applicant: Intel Corporation

Inventor： Omkar KARHADE ,  William J. LAMBERT ,  Xiaoqian LI ,  Sidharth DALMIA

IPC: H01Q1/02 ,  H01Q1/22 ,  H03F3/24 ,  H03F3/195

Abstract: Embodiments include an electronic package that includes a radio frequency (RF) front end. In an embodiment, the RF front end may comprise a package substrate and a first die attached to a first surface of the package substrate. In an embodiment, the first die may include CMOS components. In an embodiment, the RF front end may further comprise a second die attached to the first surface of the package substrate. In an embodiment, the second die may comprise amplification circuitry. In an embodiment, the RF front end may further comprise an antenna attached to a second surface of the package substrate. In an embodiment, the second surface is opposite from the first surface.