公开(公告)号：US20230397323A1

公开(公告)日：2023-12-07

申请号：US17834641

申请日：2022-06-07

Applicant: Intel Corporation

Inventor： Min Suet LIM ,  Tin Poay CHUAH ,  Yew San LIM ,  Jeff KU ,  Twan Sing LOO ,  Poh Boon KHOO ,  Jiun Hann SIR

IPC: H05K1/02 ,  H01L23/367 ,  H01L25/065 ,  H01L25/18 ,  H05K3/22 ,  H01L23/42

CPC classification number: H05K1/0204 ,  H01L23/3675 ,  H01L25/0652 ,  H01L25/18 ,  H05K3/22 ,  H01L23/42 ,  H01L2224/32225 ,  H01L24/32

Abstract: Embodiments disclosed herein include a printed circuit board (PCB). In an embodiment, the PCB comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a first slot is through a thickness of the substrate, and a second slot is through the thickness of the substrate, where the first slot is parallel to the second slot. In an embodiment, a metal plate is provided on the PCB. In an embodiment the metal plate comprises a first portion over the first surface of the substrate between the first slot and the second slot, a second portion connected to the first portion, wherein the second portion is in the first slot, and a third portion connected to the first portion, wherein the third portion is in the second slot.

公开(公告)号：US20230337406A1

公开(公告)日：2023-10-19

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu BAWA ,  Ruander CARDENAS ,  Kathiravan D ,  Jia Yan GO ,  Chin Kung GOH ,  Jeff KU ,  Prakash Kurma RAJU ,  Baomin LIU ,  Twan Sing LOO ,  Mikko MAKINEN ,  Columbia MISHRA ,  Juha PAAVOLA ,  Prasanna PICHUMANI ,  Daniel RAGLAND ,  Kannan RAJA ,  Khai Ern SEE ,  Javed SHAIKH ,  Gokul SUBRAMANIAM ,  George Baoci SUN ,  Xiyong TIAN ,  Hua YANG ,  Mark CARBONE ,  Vivek PARANJAPE ,  Nehakausar PINJARI ,  Hari Shanker THAKUR ,  Christopher MOORE ,  Gustavo FRICKE ,  Justin HUTTULA ,  Gavin SUNG ,  Sammi WY LIU ,  Arnab SEN ,  Chun-Ting LIU ,  Jason Y. JIANG ,  Gerry JUAN ,  Shih Wei NIEN ,  Lance LIN ,  Evan KUKLINSKI

IPC: H05K7/20 ,  H01L23/34 ,  G06F1/20

CPC classification number: H05K7/20963 ,  H01L23/34 ,  G06F1/203 ,  H05K7/20336 ,  H05K7/2099 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20154

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.