公开(公告)号：US20240410396A1

公开(公告)日：2024-12-12

申请号：US18329763

申请日：2023-06-06

Applicant: Intel Corporation

Inventor： Arnab Sen ,  Srinivasarao Konakalla ,  Samarth Alva ,  Amit Kumar ,  Rachit Garg ,  Bhavaneeswaran Anbalagan ,  Raghavendra S. Kanivihalli ,  Prasanna Pichumani

IPC: F04D29/66 ,  F04D17/16 ,  F04D25/08 ,  F04D29/28 ,  G06F1/20

Abstract: Impeller architecture for a cooling fan and methodology for making same. The impeller architecture includes a plurality of blades, individual ones of the blades have a first end that is attached to a hub component in a sequential order, such that sequential first ends are attached to the circumference. An indexing function is applied to the sequential order, and blades or the spaces therebetween are modified accordingly to have a blade type based on their sequential location and the indexing function. The indexing function can be, in a non-limiting example, odd numbers or prime numbers.

公开(公告)号：US20240175640A1

公开(公告)日：2024-05-30

申请号：US18395919

申请日：2023-12-26

Applicant: Intel Corporation

Inventor： Santosh Gangal ,  Akarsha Kadadevaramath ,  Raghavendra S. Kanivihalli ,  Prakash Kurma Raju ,  Navneet Singh ,  Sarma Vmk Vedhanabhatla

IPC: F28D15/04

CPC classification number: F28D15/04

Abstract: A heat pipe, including: a variable dimension heat pipe exoskeleton formed of a heat-conductive material by blow molding or additive manufacturing, wherein the variable dimension heat pipe exoskeleton including: a first heat pipe exoskeleton portion with a dimension having a first value; and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value. Further, a method of manufacturing a heat pipe, including: providing a heat-conductive material; and performing blow molding or additive manufacturing to form a variable dimension heat pipe exoskeleton of the heat-conductive material, wherein the heat pipe exoskeleton has a first heat pipe exoskeleton portion with a dimension having a first value, and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value.

公开(公告)号：US20210109576A1

公开(公告)日：2021-04-15

申请号：US17131375

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Prakash Kurma Raju ,  Prasanna Pichumani ,  Raghavendra S. Kanivihalli

IPC: G06F1/20 ,  G06F1/16

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first portion chassis, a second portion chassis, and a hinge that rotatably couples the first portion chassis to the second portion chassis. The electronic device also includes a flexible heat spreader that extends from the second portion chassis, through the hinge, and to the first portion chassis, where the flexible heat spreader includes frills that can accommodate deformations in the flexible heat spreader when the first portion chassis is rotated relative to the second portion chassis.

公开(公告)号：US20210096618A1

公开(公告)日：2021-04-01

申请号：US17119253

申请日：2020-12-11

Applicant: Intel Corporation

Inventor： Arunpandi Radhakrishnan ,  Bijendra Singh ,  Samarth Alva ,  Raghavendra S. Kanivihalli

IPC: G06F1/20 ,  G06F1/16

Abstract: In one embodiment, a computer system (e.g., a notebook computer) includes a lid with a display and a base coupled to the lid at one end of the base. The base defines one or more openings proximate to the end at which the lid is coupled to the base, and the computer system further includes a solid panel positioned proximate to the openings in the base such that the panel partially blocks the openings of the base. The position of the solid panel with respect to the openings of the base is based on a position of the lid with respect to the base.