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公开(公告)号：US10720407B2
公开(公告)日：2020-07-21
申请号：US16210540
申请日：2018-12-05
Applicant: Intel Corporation
Inventor： Navneet K. Singh , Ranjul Balakrishnan
IPC: H01L25/065 , H01L23/498 , H01L23/538 , H01L23/13
Abstract: A microelectronic interposer for a microelectronic package may be fabricated, wherein a first microelectronic device within the microelectronic package is in electronic communication with at least one second microelectronic device through the microelectronic interposer which positions the at least one second microelectronic device outside a periphery of the first microelectronic device. The microelectronic interposer may further include at least one recess for achieving a desired height and/or enabling various configurations for the microelectronic package.
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公开(公告)号：US10656177B2
公开(公告)日：2020-05-19
申请号：US16410852
申请日：2019-05-13
Applicant: Intel Corporation
Inventor： Vikas Rao , Navneet K. Singh , Naveen G
Abstract: A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.
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公开(公告)号：US10317428B2
公开(公告)日：2019-06-11
申请号：US15341726
申请日：2016-11-02
Applicant: INTEL CORPORATION
Inventor： Vikas Rao , Navneet K. Singh , Naveen G
Abstract: Disclosed herein is technology of a probe connector for a probing pad structure around a thermal attach mounting hole. A probe connector includes a socket frame including a first channel and an elongated body including a second channel. Socket conductors are disposed in the socket frame around the first channel. The second channel is disposed at a first distal end of the elongated body, and the elongated body is disposed on the socket frame. The socket conductors are to make electrical contact with a probing pad structure disposed on a surface area around a thermal attach mounting hole of a circuit board in response to a loading attachment engaging with the elongated body via the second channel, the socket frame via the first channel, and the circuit board via the thermal attach mounting hole.
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4.发明授权公开(公告)号：US10734393B2
公开(公告)日：2020-08-04
申请号：US16182972
申请日：2018-11-07
Applicant: Intel Corporation
Inventor： Navneet K. Singh , Shanto A. Thomas , Ranjul Balakrishnan
IPC: H01L29/66 , H01L21/332 , H01L27/11512 , H01L27/108 , H01L25/065 , H01L23/00
Abstract: Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a die on a board, attaching a substrate on the die, wherein the substrate comprises a first region and a peripheral region, attaching a first memory device on the central region of the substrate, and attaching at least one additional memory device on the peripheral region of the substrate, wherein the at least one additional memory device is not disposed over the die.
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公开(公告)号：US20190109115A1
公开(公告)日：2019-04-11
申请号：US16210540
申请日：2018-12-05
Applicant: Intel Corporation
Inventor： Navneet K. Singh , Ranjul Balakrishnan
IPC: H01L25/065 , H01L23/498
Abstract: A microelectronic interposer for a microelectronic package may be fabricated, wherein a first microelectronic device within the microelectronic package is in electronic communication with at least one second microelectronic device through the microelectronic interposer which positions the at least one second microelectronic device outside a periphery of the first microelectronic device. The microelectronic interposer may further include at least one recess for achieving a desired height and/or enabling various configurations for the microelectronic package.
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Patent Agency Ranking
公开(公告)号：US10199353B2
公开(公告)日：2019-02-05
申请号：US15262935
申请日：2016-09-12
Applicant: INTEL CORPORATION
Inventor： Navneet K. Singh , Ranjul Balakrishnan
IPC: H01L23/498 , H01L25/065
Abstract: A microelectronic interposer for a microelectronic package may be fabricated, wherein a first microelectronic device within the microelectronic package is in electronic communication with at least one second microelectronic device through the microelectronic interposer which positions the at least one second microelectronic device outside a periphery of the first microelectronic device. The microelectronic interposer may further include at least one recess for achieving a desired height and/or enabling various configurations for the microelectronic package.
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公开(公告)号：US20180120347A1
公开(公告)日：2018-05-03
申请号：US15341726
申请日：2016-11-02
Applicant: INTEL CORPORATION
Inventor： Vikas Rao , Navneet K. Singh , Naveen G
CPC classification number: G01R1/0416 , G01R1/07371
Abstract: Disclosed herein is technology of a probe connector for a probing pad structure around a thermal attach mounting hole. A probe connector includes a socket frame including a first channel and an elongated body including a second channel. Socket conductors are disposed in the socket frame around the first channel. The second channel is disposed at a first distal end of the elongated body, and the elongated body is disposed on the socket frame. The socket conductors are to make electrical contact with a probing pad structure disposed on a surface area around a thermal attach mounting hole of a circuit board in response to a loading attachment engaging with the elongated body via the second channel, the socket frame via the first channel, and the circuit board via the thermal attach mounting hole.
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公开(公告)号：US20180076171A1
公开(公告)日：2018-03-15
申请号：US15262935
申请日：2016-09-12
Applicant: INTEL CORPORATION
Inventor： Navneet K. Singh , Ranjul Balakrishnan
IPC: H01L25/065 , H01L23/498
CPC classification number: H01L25/0652 , H01L23/49811 , H01L2224/16225 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572
Abstract: A microelectronic interposer for a microelectronic package may be fabricated, wherein a first microelectronic device within the microelectronic package is in electronic communication with at least one second microelectronic device through the microelectronic interposer which positions the at least one second microelectronic device outside a periphery of the first microelectronic device. The microelectronic interposer may further include at least one recess for achieving a desired height and/or enabling various configurations for the microelectronic package.
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公开(公告)号：US20220015273A1
公开(公告)日：2022-01-13
申请号：US17483415
申请日：2021-09-23
Applicant: Intel Corporation
Inventor： Bala P. Subramanya , Prakash Kurma Raju , Navneet K. Singh , Sachin Bedare , Vijith Halestoph R.
Abstract: An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.
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公开(公告)号：US20190271720A1
公开(公告)日：2019-09-05
申请号：US16410852
申请日：2019-05-13
Applicant: Intel Corporation
Inventor： Vikas Rao , Navneet K. Singh , Naveen G
Abstract: A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.
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