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    PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH MOUNTING HOLE
    1.
    发明申请
    PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH MOUNTING HOLE 审中-公开

    公开(公告)号：US20180120347A1

    公开(公告)日：2018-05-03

    申请号：US15341726

    申请日：2016-11-02

    Applicant: INTEL CORPORATION

    Inventor： Vikas Rao ,  Navneet K. Singh ,  Naveen G

    IPC: G01R1/04 ,  G01R1/30

    CPC classification number: G01R1/0416 ,  G01R1/07371

    Abstract: Disclosed herein is technology of a probe connector for a probing pad structure around a thermal attach mounting hole. A probe connector includes a socket frame including a first channel and an elongated body including a second channel. Socket conductors are disposed in the socket frame around the first channel. The second channel is disposed at a first distal end of the elongated body, and the elongated body is disposed on the socket frame. The socket conductors are to make electrical contact with a probing pad structure disposed on a surface area around a thermal attach mounting hole of a circuit board in response to a loading attachment engaging with the elongated body via the second channel, the socket frame via the first channel, and the circuit board via the thermal attach mounting hole.

    Probe connector for a probing pad structure around a thermal attach mounting hole
    3.
    发明授权
    Probe connector for a probing pad structure around a thermal attach mounting hole 有权

    公开(公告)号：US10656177B2

    公开(公告)日：2020-05-19

    申请号：US16410852

    申请日：2019-05-13

    Applicant: Intel Corporation

    Inventor： Vikas Rao ,  Navneet K. Singh ,  Naveen G

    IPC: G01R1/04 ,  G01R1/073

    Abstract: A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.

    Probe connector for a probing pad structure around a thermal attach mounting hole
    4.
    发明授权
    Probe connector for a probing pad structure around a thermal attach mounting hole 有权

    公开(公告)号：US10317428B2

    公开(公告)日：2019-06-11

    申请号：US15341726

    申请日：2016-11-02

    Applicant: INTEL CORPORATION

    Inventor： Vikas Rao ,  Navneet K. Singh ,  Naveen G

    IPC: G01R1/04 ,  G01R1/073

    Abstract: Disclosed herein is technology of a probe connector for a probing pad structure around a thermal attach mounting hole. A probe connector includes a socket frame including a first channel and an elongated body including a second channel. Socket conductors are disposed in the socket frame around the first channel. The second channel is disposed at a first distal end of the elongated body, and the elongated body is disposed on the socket frame. The socket conductors are to make electrical contact with a probing pad structure disposed on a surface area around a thermal attach mounting hole of a circuit board in response to a loading attachment engaging with the elongated body via the second channel, the socket frame via the first channel, and the circuit board via the thermal attach mounting hole.

    METHOD AND APPARATUS FOR ACCURATE MEASUREMENT OF PLATFORM POWER
    6.
    发明申请
    METHOD AND APPARATUS FOR ACCURATE MEASUREMENT OF PLATFORM POWER 有权

    公开(公告)号：US20210349134A1

    公开(公告)日：2021-11-11

    申请号：US17109031

    申请日：2020-12-01

    Applicant: Intel Corporation

    Inventor： Sriram Ranganathan ,  Naveen G ,  Pannerkumar Rajagopal ,  Govindaraj Gettimalli ,  Javahar Ragothaman

    IPC: G01R21/133 ,  G06F1/3246 ,  G06F1/3234

    Abstract: A Power Management Controller (PMC) which manages power states of a platform, informs a power accumulator device to start measuring the platform power during entry into the low power state (e.g., S0iX). The power accumulator device starts measuring the power until a stop message comes from the PMC. The PMC on detection of any wake event initiates a stop message to the power accumulator device. Once an operating system (OS) context is restored, software can read the measured data from the power accumulator device. The measured data is accessible to a host software using standard software application programming interface (API) and can be used to influence the power policies of the system.

    PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH MOUNTING HOLE
    7.
    发明申请
    PROBE CONNECTOR FOR A PROBING PAD STRUCTURE AROUND A THERMAL ATTACH MOUNTING HOLE 审中-公开

    公开(公告)号：US20190271720A1

    公开(公告)日：2019-09-05

    申请号：US16410852

    申请日：2019-05-13

    Applicant: Intel Corporation

    Inventor： Vikas Rao ,  Navneet K. Singh ,  Naveen G

    IPC: G01R1/04 ,  G01R1/073

    Abstract: A system includes a probe connector including first traces coupled to first conductors curvilinearly arranged around a first elongated portion of the probe connector. The system further includes a circuit board including second traces coupled to first connector pads curvilinearly arranged around a first hole in the circuit board. The first connector pads are to couple to the first conductors of the probe connector when the first elongated portion is inserted in the first hole. The system further comprises a first integrated circuit disposed on the circuit board, the first integrated circuit being coupled to the second traces.

    EXTENDING PROCESSOR PERFORMANCE
    8.
    发明申请
    EXTENDING PROCESSOR PERFORMANCE 审中-公开

    公开(公告)号：US20190171269A1

    公开(公告)日：2019-06-06

    申请号：US16269551

    申请日：2019-02-06

    Applicant: Intel Corporation

    Inventor： Naveen G ,  Bharath Kumar

    IPC: G06F1/26 ,  G06F13/20 ,  G06F13/40

    Abstract: Technology for a system operable to extend a level of processor performance is disclosed. The system can comprise a power source connected to a platform voltage regulator (VR) and one or more processors and configured to provide an input power to the platform VR. The system can further comprise the platform VR connected to a peripheral interface and the one or more processors and configured to power the peripheral interface and send a power good signal to the one or more processors. The system can further comprise the peripheral interface connected to the platform VR and the one or more processors and configured to connect to a peripheral device and send a signal to the one or more processors when a peripheral interface connection state is identified as connected.

    Extending processor performance
    10.
    发明授权
    Extending processor performance 有权

    公开(公告)号：US11327547B2

    公开(公告)日：2022-05-10

    申请号：US17068704

    申请日：2020-10-12

    Applicant: Intel Corporation

    Inventor： Naveen G ,  Bharath Kumar

    IPC: G06F1/32 ,  G06F1/26 ,  G06F1/3206

    Abstract: Technology for a system operable to extend a level of processor performance is disclosed. The system can comprise a power source connected to a platform voltage regulator (VR) and one or more processors and configured to provide an input power to the platform VR. The system can further comprise the platform VR connected to a peripheral interface and the one or more processors and configured to power the peripheral interface and send a power good signal to the one or more processors. The system can further comprise the peripheral interface connected to the platform VR and the one or more processors and configured to connect to a peripheral device and send a signal to the one or more processors when a peripheral interface connection state is identified as connected.

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