公开(公告)号：US20230282509A1

公开(公告)日：2023-09-07

申请号：US17685421

申请日：2022-03-03

申请人： Intel Corporation

发明人： Tin DO ,  Long Thanh NGUYEN ,  Phu Tuc NGUYEN ,  Le Hoai Bao NGUYEN

IPC分类号： H01L21/683 ,  H01L21/603

CPC分类号： H01L21/6838 ,  H01L21/603

摘要： An apparatus includes a nozzle including a small die vacuum line disposed on a surface of the nozzle, and a large die vacuum line disposed on the surface and surrounding the small die vacuum line. The nozzle further includes a first die vacuum hole disposed through the surface and the small die vacuum line, and a second die vacuum hole disposed through the surface and the large die vacuum line. The small die vacuum line and the first die vacuum hole are configured to provide a vacuum to a small semiconductor die to be attached to a substrate, and the small die vacuum line, the large die vacuum line, the first die vacuum hole and the second die vacuum hole are configured to provide the vacuum to a large semiconductor die to be attached to the substrate.

公开(公告)号：US20240217122A1

公开(公告)日：2024-07-04

申请号：US18090383

申请日：2022-12-28

申请人： Intel Corporation

发明人： Long Thanh NGUYEN ,  Tin DO ,  Le Hoai Bao NGUYEN ,  Phu Tuc NGUYEN ,  Hung Quy SOI

IPC分类号： B25J15/06 ,  B25J9/16 ,  B25J11/00 ,  H05K3/36

CPC分类号： B25J15/0683 ,  B25J9/1687 ,  B25J11/005 ,  B25J11/0095 ,  H05K3/36

摘要： This disclosure describes enhanced substrate transfer arm (STA) and pedestal designs related to a thermal compression bonding process. The designs include multiple row patterns of the STA and the pedestal used to: pick up a first substrate row from a first row of a tray; place the first substrate row onto a first row of a bond stage corresponding to the first row of the tray; pick up a second substrate row from the tray; place, using the suction cups, the second substrate row onto a remaining empty row of the bond stage; pick up the first substrate row after thermal bonding from the bond stage; place the first substrate row after thermal bonding onto the tray; when all substrates from the tray have been thermally bonded, pick up a last substrate row after thermal bonding from the bond stage; and place the last substrate row onto the tray.