公开(公告)号：US20190103345A1

公开(公告)日：2019-04-04

申请号：US15721707

申请日：2017-09-29

申请人： Intel Corporation

发明人： Kyle YAZZIE ,  Venkata Suresh R. GUTHIKONDA ,  Patrick NARDI ,  Santosh SANKARASUBRAMANIAN ,  Kevin Y. LIN ,  Leigh M. TRIBOLET ,  John L. HARPER ,  Pramod MALATKAR

IPC分类号： H01L23/498 ,  H01L23/367 ,  H01L21/50 ,  H01L23/52 ,  H01L23/00 ,  H05K1/02

摘要： An apparatus, comprising a first platform comprising a first working surface having a first non-planar portion; and a second platform comprising a second working surface having a second non-planar portion, wherein: the second working surface is opposite the first working surface, a distance between the first working surface and the second working surface is adjustable, the first non-planar portion comprises a first curved portion, and the second non-planar portion comprises a second curved portion opposite the first curved portion.

公开(公告)号：US20200066655A1

公开(公告)日：2020-02-27

申请号：US16611830

申请日：2017-06-30

申请人： Intel Corporation

发明人： Feras EID ,  Venkata Suresh R. GUTHIKONDA ,  Shankar DEVASENATHIPATHY ,  Chandra M. JHA ,  Je-Young CHANG ,  Kyle YAZZIE ,  Prasanna RAGHAVAN ,  Pramod MALATKAR

IPC分类号： H01L23/00 ,  H01L23/544 ,  H05K1/02 ,  H05K1/18 ,  H01L25/065 ,  H01L21/50

摘要： A foundation layer having a stiffener and methods of forming a stiffener are described. One or more dies are formed over the foundation layer. Each die has a front side surface that is electrically coupled to the foundation layer and a back side surface that is opposite from the front side surface. A stiffening layer (or a stiffener) is formed on the back side surface of at least one of the dies. The stiffening layer may be directly coupled to the back side surface of the one or more dies without an adhesive layer. The stiffening layer may include one or more materials, including at least one of a metal, a metal alloy, and a ceramic. The stiffening layer may be formed to reduce warpage based on the foundation layer and the dies. The one or more materials of the stiffening layer can be formed using a cold spray.

公开(公告)号：US20180322993A1

公开(公告)日：2018-11-08

申请号：US15770747

申请日：2015-12-21

申请人： Intel Corporation

发明人： Kyle YAZZIE ,  Pramod MALATKAR

IPC分类号： H01F7/02 ,  B25J15/06 ,  G01R1/067

CPC分类号： H01F7/0257 ,  B25J15/0608 ,  B81C1/00 ,  G01R1/06705

摘要： A magnetic pick and place probe includes an outer sheath, an inner sheath to vertically slide within the outer sheath, None or more sheath magnets attached to a bottom end of the inner sheath and a tip positioned at a bottom end of the outer sheath to simultaneously pick up an array of magnets for placement on a substrate.