公开(公告)号：US20240203664A1

公开(公告)日：2024-06-20

申请号：US18081362

申请日：2022-12-14

申请人： Intel Corporation

发明人： Yosef KORNBLUTH ,  Bainye Francoise ANGOUA ,  Whitney BRYKS ,  Daniel ROSALES-YEOMANS ,  Aaditya Anand CANDADAI ,  Holly CLINGAN ,  Jade Sharee LEWIS ,  Patrick QUACH ,  Srinivas V. PIETAMBARAM

IPC分类号： H01G4/33 ,  H01G4/10

CPC分类号： H01G4/33 ,  H01G4/105

摘要： Embodiments disclosed herein include a core for a package substrate. In an embodiment, the core comprises a first substrate with a first surface and a second surface, a first recess into the first surface of the first substrate, a first layer in the first recess, where the first layer is electrically conductive, a second layer over the first layer, where the second layer is a dielectric layer, and a third layer over the second layer, where the third layer is electrically conductive. In an embodiment, the core further comprises a second substrate with a third surface and a fourth surface, where the third surface of the second substrate faces the first surface of the first substrate, a second recess in the third surface of the second substrate, and a fourth layer in the second recess, where the fourth layer is electrically conductive, and the fourth layer contacts the third layer.

公开(公告)号：US20240177907A1

公开(公告)日：2024-05-30

申请号：US18059992

申请日：2022-11-30

申请人： Intel Corporation

发明人： Yosef KORNBLUTH ,  Whitney BRYKS ,  Ravindranadh ELURI ,  Aaditya Anand CANDADAI ,  Srinivas PIETAMBARAM

IPC分类号： H01F7/20 ,  B32B3/18

CPC分类号： H01F7/206 ,  B32B3/18 ,  B32B15/18

摘要： The present disclosure is directed to a carrier chuck having a base plate with a top surface, a plurality of first magnets positioned in a first region of the top surface, the plurality of first magnets configured to produce a first electromagnetic field to retain or suspend a panel placed on the carrier chuck during panel processing, wherein the first region corresponds to a region of the panel which comprises a magnetic material.

公开(公告)号：US20240153857A1

公开(公告)日：2024-05-09

申请号：US17983230

申请日：2022-11-08

申请人： Intel Corporation

发明人： Bainye Francoise ANGOUA ,  Whitney BRYKS ,  Yosef KORNBLUTH ,  Daniel ROSALES-YEOMANS ,  Holly CLINGAN ,  Patrick QUACH ,  Jade Sharee LEWIS ,  Aaditya Anand CANDADAI

IPC分类号： H01L23/498 ,  H01L23/15 ,  H01L23/544

CPC分类号： H01L23/49827 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/544 ,  H01L24/16 ,  H01L2223/54426 ,  H01L2224/16225

摘要： Embodiments disclose a package substrate. In an embodiment, the package substrate comprises a core, where the core comprises: a first sub-core, where the first sub-core comprises a glass and a first through glass via (TGV), and a second sub-core, where the second sub-core comprises the glass and a second TGV. In an embodiment, the first TGV directly contacts the second TGV.

公开(公告)号：US20240186197A1

公开(公告)日：2024-06-06

申请号：US18060592

申请日：2022-12-01

申请人： Intel Corporation

发明人： Aaditya Anand CANDADAI ,  Nicholas HAEHN ,  Ao WANG ,  Whitney BRYKS ,  Srinivas PIETAMBARAM

IPC分类号： H01L23/16

CPC分类号： H01L23/16

摘要： The present disclosure is directed to a semiconductor panel providing a laminated structure and a plurality of electrically isolated structures distributed throughout the laminated structure to increase an attraction between the laminated structure and an electrostatic chuck. In an aspect, the electrically isolated structures are positioned in spaces in the semiconductor panel without electrically active devices and interconnects. In yet another aspect, the present method provides a semiconductor panel and forming a plurality of electrically isolated structures in selected positions on the semiconductor panel and an electrostatic chuck configured to carry an electrostatic charge for producing an electrostatic force at its top surface, placing the semiconductor panel on the electrostatic chuck, and activating the electrostatic chuck to induce polarization at the top surface to produce an attractive force having a greater magnitude at the positions with the plurality of electrically isolated structures.