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170 条记录 (耗时 0.025 秒)

    Electronic device
    1.
    发明授权
    Electronic device 有权

    公开(公告)号：US12111531B2

    公开(公告)日：2024-10-08

    申请号：US18096546

    申请日：2023-01-12

    申请人： InnoLux Corporation

    发明人： Jui-Jen Yueh ,  Kuan-Feng Lee ,  Tsung-Han Tsai

    IPC分类号： G02F1/1335 ,  H10K50/86

    CPC分类号： G02F1/133512 ,  H10K50/865

    摘要： An electronic device is disclosed by this disclosure. The electronic device includes a pixel substrate and a first light blocking structure. The pixel substrate includes a first pixel. The first light blocking structure is disposed on the pixel substrate, and the first light blocking structure includes a first unit and a second unit. In a top view direction of the electronic device, the first unit and the second unit are separated from each other in a first direction by a first pitch, and the first pixel has an exposed part between the first unit and the second unit. The exposed part has a first length in the first direction, a first ratio is a ratio of the first length to the first pitch, and the first ratio is greater than or equal to 0.4 and less than or equal to 0.85.

    Semiconductor device
    2.
    发明授权
    Semiconductor device 有权

    公开(公告)号：US12087667B2

    公开(公告)日：2024-09-10

    申请号：US18144573

    申请日：2023-05-08

    申请人： InnoLux Corporation

    发明人： Jui-Jen Yueh ,  Kuan-Feng Lee ,  Yuan-Lin Wu

    IPC分类号： H01L23/48 ,  H01L23/532 ,  H01L29/423

    CPC分类号： H01L23/481 ,  H01L23/53228 ,  H01L29/42372

    摘要： An electronic device includes: a substrate including a through hole; a connecting element disposed in the through hole; a first insulating layer disposed on the substrate and including a first via; a first conductive element disposed on the first insulating layer and electrically connected to the connecting element through the first via; a second insulating layer disposed on the first conductive element and comprising a second via; a second conductive element disposed on the second insulating layer and electrically connected to the first conductive element through the second via; and a third conductive element disposed under the substrate and electrically connected to the connecting element, wherein, in a cross-sectional view of the electronic device, the second via is not overlapping with the connecting element.

    DISPLAY
    5.
    发明公开
    DISPLAY 审中-公开

    公开(公告)号：US20240184128A1

    公开(公告)日：2024-06-06

    申请号：US18422005

    申请日：2024-01-25

    申请人： InnoLux Corporation

    发明人： Jui-Jen Yueh

    IPC分类号： G02B27/60 ,  B60K35/00 ,  B60K35/22 ,  H01L25/16

    CPC分类号： G02B27/60 ,  B60K35/00 ,  H01L25/167 ,  B60K35/22

    摘要： The present disclosure provides a display in application of a vehicle. The display includes two display devices, in which at least one of the two display devices includes a display panel and a light controller. The display panel includes a plurality of signal lines respectively extending along a first direction. The light controller is disposed adjacent to the display panel and includes a plurality of patterns respectively extending along a second direction, in which the second direction is different from the first direction. The display devices are arranged along the first direction.

    ELECTRONIC DEVICE
    6.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240090307A1

    公开(公告)日：2024-03-14

    申请号：US18515182

    申请日：2023-11-20

    申请人： Innolux Corporation

    发明人： Jui-Jen Yueh ,  Tsung-Han Tsai

    IPC分类号： H10K77/10

    CPC分类号： H10K77/111

    摘要： An electronic device has a first substrate having a hole. A circuit is disposed on the first substrate. A conductive element is disposed in the hole of the first substrate. A second substrate is corresponded to the first substrate, the second substrate has an opening which penetrates the second substrate and corresponds to the conductive element. An electronic component is corresponded to the second substrate, and the electronic component is electrically connected to the circuit and the conductive element.

    Sensing device
    7.
    发明授权
    Sensing device 有权

    公开(公告)号：US11907458B2

    公开(公告)日：2024-02-20

    申请号：US18079882

    申请日：2022-12-13

    申请人： Innolux Corporation

    发明人： Hsiao-Lang Lin ,  Jui-Jen Yueh

    IPC分类号： G06F3/041 ,  G06F3/044 ,  H10K59/40 ,  H10K59/131

    CPC分类号： G06F3/0412 ,  G06F3/0443 ,  G06F3/0446 ,  G06F3/04164 ,  H10K59/40 ,  G06F2203/04103 ,  H10K59/131

    摘要： A sensing device includes a substrate, a first insulating layer, a second insulating layer, a sensing part, a first transmission part, a first conductive connection structure, a second transmission part, a conducting layer, a second conductive connection structure and a third transmission part. The second insulating layer is disposed between the first insulating layer and the substrate. The sensing part is disposed above the first insulating layer. The first transmission part is disposed above the first insulating layer. The first transmission part is electrically connected to the sensing part. The second transmission part is disposed below the first transmission part. The first transmission part is electrically connected to the second transmission part via the first conductive connection structure. The conducting layer is disposed between the second insulating layer and the substrate. The second transmission part is electrically connected to the third transmission part via the second conductive connection structure.

    Method for manufacturing electronic device
    8.
    发明授权
    Method for manufacturing electronic device 有权

    公开(公告)号：US11864456B2

    公开(公告)日：2024-01-02

    申请号：US17412264

    申请日：2021-08-26

    申请人： Innolux Corporation

    发明人： Jui-Jen Yueh ,  Tsung-Han Tsai

    IPC分类号： H10K77/10

    CPC分类号： H10K77/111

    摘要： A method for manufacturing an electronic device is provided by the disclosure. A flexible substrate is provided, in which the flexible substrate has two surfaces opposite to each other. A circuit is formed on one of the surfaces of the flexible substrate. A through hole is formed in the flexible substrate. A conductive bridge is formed in the through hole. A supporting substrate is attached to the other surface of the flexible substrate. An opening penetrating the supporting substrate is formed, and the opening corresponds to the through hole in the flexible substrate. An electronic component is mounted on the supporting substrate, and the electronic component is allowed to be electrically connected to the circuit through the conductive bridge.

    DISPLAY DEVICE
    10.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号：US20230359088A1

    公开(公告)日：2023-11-09

    申请号：US18218127

    申请日：2023-07-05

    申请人： InnoLux Corporation

    发明人： Hsiao-Lang Lin ,  Jui-Jen Yueh ,  Kuan-Feng Lee ,  Jia-Yuan Chen

    IPC分类号： G02F1/13357 ,  G02F1/1335

    CPC分类号： G02F1/133617 ,  G02F1/133621 ,  G02F1/133624 ,  G02F2202/36

    摘要： A display device is provided and includes at least two sub-pixels. One of the sub-pixels is a blue sub-pixel. Each of the sub-pixels includes a light emitting unit and a light converting layer disposed on the light emitting unit. A thickness of the light converting layer of another one of the sub-pixels is greater than a thickness of the light converting layer of the one of the sub-pixels. The one of the sub-pixels emits an output light under an operation of the highest gray level, the output light is a final visual light of the blue sub-pixel of the display device, and the output light has an output spectrum. A wavelength of a first wave of the output spectrum ranges from 380 nm to 493 nm, and a full width at half maximum of the first wave ranges from 10 nm to 30 nm.