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公开(公告)号：US12040350B2
公开(公告)日：2024-07-16
申请号：US18073580
申请日：2022-12-02
申请人： Innolux Corporation
发明人： Yi-An Chen , Wan-Ling Huang , Tsau-Hua Hsieh
CPC分类号： H01L27/156 , H01L33/486 , H01L33/50 , H01L33/58
摘要： The display device includes a first substrate, a second substrate, a red filter layer, a green filter layer, a blue filter layer, a first light emitting diode and a second light emitting diode. The red filter layer, the green filter layer and the blue filter layer are disposed between the first substrate and the second substrate. A portion of the red filter layer, a portion of the green filter layer and a portion of the blue filter layer are stacked with each other to form a light blocking structure. The first light emitting diode and the second light emitting diode are disposed between the first substrate and the second substrate and adjacent to each other. An orthographic projection of the light blocking structure on the second substrate is located between orthographic projections of the first light emitting diode and the second light emitting diode on the second substrate.
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公开(公告)号：US20240094787A1
公开(公告)日：2024-03-21
申请号：US18522044
申请日：2023-11-28
申请人： Innolux Corporation
发明人： Wan-Ling Huang , Jian-Jung Shih , Jui-Feng Ko , Tsau-Hua Hsieh
CPC分类号： G06F1/189 , G06F1/182 , G09F9/3026
摘要： A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.
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公开(公告)号：US20230246121A1
公开(公告)日：2023-08-03
申请号：US18298343
申请日：2023-04-10
申请人： Innolux Corporation
发明人： Kai Cheng , Tsau-Hua Hsieh , Jian-Jung Shih , Fang-Ying Lin , Hui-Chieh Wang , Wan-Ling Huang
IPC分类号： H01L33/00 , H01L25/075
CPC分类号： H01L33/0095 , H01L25/0753 , H01L2933/0066
摘要： A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.
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公开(公告)号：US11528832B2
公开(公告)日：2022-12-13
申请号：US17180878
申请日：2021-02-22
申请人： InnoLux Corporation
发明人： Wan-Ling Huang , Tzu-Yuan Lin , Geng-Fu Chang , Chun-Hsien Lin , Shu-Ming Kuo , Jui-Feng Ko , Tsau-Hua Hsieh
摘要： An electronic device is provided, which is for coupling to another electronic device in a side-by-side manner, and the electronic device includes a substrate, a first thermal dissipation sheet and a thermal dissipation element. The substrate includes a first surface and a second surface. The first thermal dissipation sheet is disposed on the first surface. The thermal dissipation element is disposed on the substrate. The first thermal dissipation sheet is disposed between the thermal dissipation element and the substrate, and the thermal dissipation element at least partially overlaps the first thermal dissipation sheet.
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公开(公告)号：US11664354B2
公开(公告)日：2023-05-30
申请号：US17107856
申请日：2020-11-30
申请人： InnoLux Corporation
发明人： Wan-Ling Huang , Chun-Hsien Lin , Yi-An Chen , Tsau-Hua Hsieh
IPC分类号： H01L25/075 , H01L33/50 , H01L33/56 , H01L33/62 , G02F1/13357 , G02F1/1333 , H01L27/32 , H01L33/58 , H01L33/54
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/62
摘要： An electronic device is provided in this disclosure. In some embodiments, the electronic device includes two display panels, a first filling element, and a second filling element. The two display panels adjoin each other. The first filling element and the second filling element are disposed between the two display panels, and a material of the first filling element is different from a material of the second filling element. In some embodiments, the electronic device includes a protection substrate, two light emitting plates, and a filling element. The two light emitting plates adjoin each other. The protection substrate is disposed corresponding to the two light emitting plates, and the two light emitting plates emit light towards the protection substrate. The filling element is disposed between the two light emitting plates.
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公开(公告)号：US11658276B2
公开(公告)日：2023-05-23
申请号：US17110305
申请日：2020-12-03
申请人： InnoLux Corporation
发明人： Wan-Ling Huang , Shu-Ming Kuo , Tsau-Hua Hsieh , Tzu-Min Yan
摘要： An electronic device including a light emitting element, a wavelength conversion layer, a conductive wire and a wavelength selection layer is provided by the present disclosure. The light emitting element is configured to emit a light. The wavelength conversion layer is configured to convert the light. The conductive wire is electrically connected to the light emitting element. The wavelength selection layer is disposed between the conductive wire and the wavelength conversion layer, wherein the conductive wire is cured by an energy beam, and the wavelength selection layer is configured to block the energy beam.
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公开(公告)号：US20220206546A1
公开(公告)日：2022-06-30
申请号：US17542506
申请日：2021-12-06
申请人： Innolux Corporation
发明人： Wan-Ling Huang , Jian-Jung Shih , Jui-Feng Ko , Tsau-Hua Hsieh
摘要： A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.
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公开(公告)号：US20200285271A1
公开(公告)日：2020-09-10
申请号：US16792903
申请日：2020-02-18
申请人： InnoLux Corporation
发明人： Wan-Ling Huang , Shu-Ming Kuo , Tsau-Hua Hsieh , Chun-Hsien Lin , Tzu-Min Yan
摘要： A tiled display device includes a first panel. The first panel includes a first lower substrate and a first upper substrate disposed opposite to the first lower substrate. The first upper substrate includes a first upper surface, a first lower surface and a first side surface located between the first upper surface and the first lower surface. The tiled display device further includes a second panel disposed adjacent to the first panel. The second panel includes a second lower substrate and a second upper substrate disposed opposite to the second lower substrate. The second upper substrate includes a second upper surface, a second lower surface and a second side surface located between the second upper surface and the second lower surface. The second side surface is disposed adjacent to the first side surface. A portion of the first side surface is not perpendicular to the first upper surface or the first lower surface, and a portion of the second side surface is not perpendicular to the second upper surface or the second lower surface.
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公开(公告)号：US10256222B2
公开(公告)日：2019-04-09
申请号：US15398374
申请日：2017-01-04
申请人： Innolux Corporation
发明人： Tung-Kai Liu , Tsau-Hua Hsieh , Bo-Feng Chen , Wan-Ling Huang
摘要： A light emitting diode substrate includes a substrate, a plurality of first light emitting diode and second light emitting diode. The first light emitting diode are disposed on the substrate and arranged along a first direction and a second direction to form a first array. The first light emitting diode have a first side length extending along the first direction and a second side length extending along the second direction. The second light emitting diode are disposed on the substrate and arranged along the first direction and the second direction to form a second array. The second light emitting diode have a third side length extending along the first direction and a forth side length extending along the second direction. A first difference between the first side length and the third side length is less than a second difference between the second side length and the forth side length.
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公开(公告)号：US20230238364A1
公开(公告)日：2023-07-27
申请号：US18129056
申请日：2023-03-30
申请人： InnoLux Corporation
发明人： Wan-Ling Huang , Chun-Hsien Lin , Yi-An Chen , Tsau-Hua Hsieh
IPC分类号： H01L25/075 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/56 , H01L33/62
摘要： An electronic device is provided in this disclosure. In some embodiments, the electronic device includes a first substrate and a second substrate adjacent to the first substrate. In some embodiments, the electronic device includes a plurality of organic light emitting diodes, a filter layer, and a third substrate. At least a part of the plurality of organic light emitting diodes are disposed on the first substrate. The filter layer is disposed at least on the second substrate. The third substrate is disposed corresponding to the first substrate and the second substrate. The plurality of organic light emitting diodes and the filter layer are disposed under the third substrate.
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