Transferring head and method for manufacturing electronic device

    公开(公告)号:US12040428B2

    公开(公告)日:2024-07-16

    申请号:US18116259

    申请日:2023-03-01

    摘要: The present disclosure provides a transferring head and a method for manufacturing an electronic device. The transferring head includes a substrate, a head unit, and a plurality of connecting elements. The head unit includes an electrode and a cantilever supporting the electrode. Two adjacent ones of the connecting elements are disposed between the substrate and the head unit. The electrode and a part of the cantilever are suspended over the substrate, and the cantilever is connected between one of the plurality of connecting elements and the electrode. The electrode is spaced apart from the plurality of connecting elements when viewed along a normal direction of the substrate.

    MANUFACTURING METHOD OF ELECTRONIC DEVICE
    3.
    发明公开

    公开(公告)号:US20240153924A1

    公开(公告)日:2024-05-09

    申请号:US18376002

    申请日:2023-10-03

    IPC分类号: H01L25/075 G09G3/00

    摘要: A manufacturing method of an electronic device is disclosed by the present disclosure. The manufacturing method includes providing a substrate, wherein the substrate includes a plurality of working areas, and each of the plurality of working areas includes a plurality of first recesses and a plurality of second recesses; disposing a plurality of first electronic units in the plurality of first recesses of the plurality of working areas through fluid transfer; identifying a defective working area from the plurality of working areas, wherein at least one of the plurality of first recesses of the defective working area has no electronic unit or a defective first electronic unit disposed therein; and disposing at least one repairing electronic unit in at least one of the plurality of second recesses of the defective working area through laser transfer.

    ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20240096857A1

    公开(公告)日:2024-03-21

    申请号:US18527381

    申请日:2023-12-04

    摘要: An electronic device includes a substrate, a spacer, a first element and a second element. The spacer is disposed on the substrate and has a first portion, a second portion, a first opening, a second opening and a third opening arranged in a first direction. In a cross-section view, the second opening is located between the first opening and the third opening, the first portion is located between the first opening and the second opening, and the second portion is located between the second opening and the third opening. A width of the first portion is less than a width of the second portion in the first direction, and an area of the second opening is different from an area of the first opening. The first element is overlapped with the first opening. The second element is overlapped with the third opening.

    METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

    公开(公告)号:US20240057264A1

    公开(公告)日:2024-02-15

    申请号:US18495763

    申请日:2023-10-27

    IPC分类号: H05K3/30 H05K1/18

    摘要: A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.

    ELECTRONIC DEVICE
    6.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20230238364A1

    公开(公告)日:2023-07-27

    申请号:US18129056

    申请日:2023-03-30

    摘要: An electronic device is provided in this disclosure. In some embodiments, the electronic device includes a first substrate and a second substrate adjacent to the first substrate. In some embodiments, the electronic device includes a plurality of organic light emitting diodes, a filter layer, and a third substrate. At least a part of the plurality of organic light emitting diodes are disposed on the first substrate. The filter layer is disposed at least on the second substrate. The third substrate is disposed corresponding to the first substrate and the second substrate. The plurality of organic light emitting diodes and the filter layer are disposed under the third substrate.

    Display device
    7.
    发明授权

    公开(公告)号:US11516919B2

    公开(公告)日:2022-11-29

    申请号:US17114917

    申请日:2020-12-08

    摘要: A display device is provided. The display device includes an auxiliary substrate, a display substrate, and a circuit board. The auxiliary substrate includes an auxiliary circuit. The display substrate is disposed on the auxiliary substrate. The display substrate includes a circuit. The circuit board is electrically connected to the auxiliary substrate. The circuit of the display substrate is electrically connected to the auxiliary circuit through a first conductive via, and the circuit board provides a signal to the auxiliary circuit.

    ELECTRONIC DEVICE
    8.
    发明申请

    公开(公告)号:US20220262847A1

    公开(公告)日:2022-08-18

    申请号:US17575643

    申请日:2022-01-14

    IPC分类号: H01L27/15 H01L33/62

    摘要: An electronic device includes multiple light-emitting boards, a second circuit board, a control board, and multiple conductive members. Each light-emitting board includes a first circuit board and multiple light-emitting elements. Multiple light-emitting elements are disposed on the first circuit board and are electrically connected to the first circuit board. Multiple light-emitting boards are disposed on the second circuit board and are electrically connected to the second circuit board. The control board is disposed on the second circuit board. Multiple conductive members are disposed on at least one side of the second circuit board. The control board is electrically connected to the second circuit board through multiple conductive members.

    DISPLAY DEVICE
    9.
    发明申请

    公开(公告)号:US20210280567A1

    公开(公告)日:2021-09-09

    申请号:US17100923

    申请日:2020-11-22

    IPC分类号: H01L25/16 H01L23/00

    摘要: A display device includes a substrate, a first signal line disposed on the substrate, and a first pixel including a first transistor having a gate electrode, a source electrode and a drain electrode, wherein the source electrode is electrically connected to the first signal line. The display device includes a fan-out line electrically connected to the first signal line, wherein the fan-out line partially overlaps the first pixel and is formed in a layer different from layers of the gate electrode, the source electrode and the drain electrode.

    DISPLAY PANEL AND TILED DISPLAY DEVICE

    公开(公告)号:US20210257347A1

    公开(公告)日:2021-08-19

    申请号:US17169561

    申请日:2021-02-08

    IPC分类号: H01L25/16

    摘要: The disclosure provides a display panel and a tiled display device. The display panel has a tiling edge and includes a non-transparent part and a transparent part. The transparent part has a peripheral edge. At least a portion of the peripheral edge of the transparent part is overlapped with the tiling edge. The tiled display device includes a plurality of display panels tiled together by the tiling edges thereof.