公开(公告)号：US20220260417A1

公开(公告)日：2022-08-18

申请号：US17577388

申请日：2022-01-18

Applicant: InnoLux Corporation

Inventor： Yu-Tsung LIU ,  Wei-Ju LIAO ,  Wei-Lin WAN ,  Cheng-Hsueh HSIEH ,  Po-Hsin LIN ,  Te-Yu LEE

IPC: G01J1/44 ,  G01J1/04 ,  H01L27/146

Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

公开(公告)号：US20240055454A1

公开(公告)日：2024-02-15

申请号：US18347338

申请日：2023-07-05

Applicant: InnoLux Corporation

Inventor： Yu-Tsung LIU ,  Hui-Ching YANG ,  Cheng-Hsueh HSIEH ,  Te-Yu LEE

IPC: H01L27/146

CPC classification number: H01L27/14623 ,  H01L27/14612 ,  H01L27/14685

Abstract: A sensing device is provided. The sensing device includes a substrate, a circuit layer, a photosensitive element, a light-shielding layer, and a conductive layer. The circuit layer is disposed on the substrate. The photosensitive element is disposed on the substrate and is electrically connected to the circuit layer. The light-shielding layer is disposed on the photosensitive element and has an opening. The opening overlaps the photosensitive element. The conductive layer is disposed on the light-shielding layer. In addition, the conductive layer passes through the opening and is electrically connected to the photosensitive element. A method of manufacturing a sensing device is also provided.

公开(公告)号：US20240210243A1

公开(公告)日：2024-06-27

申请号：US18596597

申请日：2024-03-05

Applicant: InnoLux Corporation

Inventor： Yu-Tsung LIU ,  Wei-Ju LIAO ,  Wei-Lin WAN ,  Cheng-Hsueh HSIEH ,  Po-Hsin LIN ,  Te-Yu LEE

IPC: G01J1/44 ,  G01J1/04 ,  G06V40/13 ,  H01L27/146

CPC classification number: G01J1/44 ,  G01J1/0411 ,  G01J1/0437 ,  H01L27/14623 ,  H01L27/14627 ,  G01J2001/446 ,  G01J2001/4473 ,  G06V40/1318

Abstract: An electronic device having a sensing region and a non-sensing region includes a sensing element, a first light shielding layer and a second light shielding layer. The sensing element is disposed corresponding to the sensing region. The first light shielding layer includes at least one first opening corresponding to the sensing element. The second light shielding layer includes at least one second opening overlapped with the first opening. In a cross-section view, a boundary between the sensing region and the non-sensing region is at an outer side of an edge of a portion of the first light shielding layer, and a horizontal distance between an edge of a portion of the second light shielding layer and the sensing element is greater than or equal to a vertical distance between the portion of the second light shielding layer and the sensing element in a top-view direction of the electronic device.

公开(公告)号：US20230273500A1

公开(公告)日：2023-08-31

申请号：US18153772

申请日：2023-01-12

Applicant: InnoLux Corporation

Inventor： Te-Yu LEE ,  Yu-Tsung LIU ,  Cheng-Hsueh HSIEH ,  Wei-Ju LIAO

IPC: G02F1/29 ,  G02C7/08

CPC classification number: G02F1/294 ,  G02C7/083 ,  G02F2202/16 ,  G02F2201/50

Abstract: An optical structure is provided. The optical structure includes a first substrate, a second substrate, a sealant, a light-modulating layer and a first conductive layer. The second substrate is disposed opposite to the first substrate. The sealant is disposed between the first substrate and the second substrate. The sealant is disposed around to form a visible area. The light-modulating layer is disposed in the visible region between the first substrate and the second substrate. The first conductive layer has a plurality of strip structures. The plurality of strip structures are disposed in the visible area to form an effective area. The visible area partially overlaps the effective area.

公开(公告)号：US20230084746A1

公开(公告)日：2023-03-16

申请号：US17818091

申请日：2022-08-08

Applicant: InnoLux Corporation

Inventor： Yu-Tsung LIU ,  Cheng-Hsueh HSIEH ,  Wei-Lin WAN ,  Te-Yu LEE

IPC: B41J11/00 ,  H01L29/786 ,  H01L49/02 ,  H01L29/66

Abstract: A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.