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公开(公告)号：US20190158183A1
公开(公告)日：2019-05-23
申请号：US16241625
申请日：2019-01-07
Applicant: Infinera Corporation
Inventor： Timothy Butrie , Michael Reffle , Xiaofeng Han , Mehrdad Ziari , Vikrant Lal , Peter W. Evans , Fred A. Klsh , Donald J. Pavinski , Jie Tang , David Coult
Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.
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公开(公告)号：US09312962B2
公开(公告)日：2016-04-12
申请号：US13675246
申请日：2012-11-13
Applicant: Infinera Corporation
Inventor： David J. Krause , Damien Lambert , Masaki Kato , Vikrant Lal , Radhakrishnan L. Nagarajan , Mehrdad Ziari , Fred A. Kish, Jr. , John D. McNicol , Han Henry Sun , Kuang-Tsan Wu
IPC: H04B10/50 , H04B10/516 , H04B10/54 , H04B10/548
CPC classification number: H04B10/5161 , H04B10/5051 , H04B10/5053 , H04B10/54 , H04B10/548
Abstract: An optical modulator includes a splitter, phase modulators, amplitude modulators, intensity modulators, and a combiner. The splitter is configured to receive light, and split the light into portions of the light. Each of the phase modulators is configured to receive a corresponding one of the portions of the light, and modulate a phase of the portion of the light to provide a phase-modulated signal. Each of the amplitude modulators is configured to receive a corresponding one of the phase-modulated signals, and modulate an amplitude of the phase-modulated signal to provide an amplitude-modulated signal. Each of the intensity modulators is configured to receive a corresponding one of the amplitude-modulated signals, and modulate an intensity of the amplitude-modulated signals to provide an intensity-modulated signal. The combiner is configured to receive the intensity-modulated signals, combine the intensity-modulated signals into a combined signal, and output the combined signal.
Abstract translation: 光调制器包括分路器，相位调制器，幅度调制器，强度调制器和组合器。 分离器被配置为接收光，并将光分解成光的一部分。 每个相位调制器被配置为接收光的对应的一部分，并调制该部分光的相位以提供相位调制信号。 每个幅度调制器被配置为接收对应的一个相位调制信号，并且调制相位调制信号的幅度以提供幅度调制信号。 每个强度调制器被配置为接收相应的幅度调制信号之一，并且调制幅度调制信号的强度以提供强度调制信号。 组合器被配置为接收强度调制信号，将强度调制信号组合成组合信号，并输出组合信号。
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公开(公告)号：US20150318952A1
公开(公告)日：2015-11-05
申请号：US14699907
申请日：2015-04-29
Applicant: Infinera Corporation
Inventor： Timothy Butrie , Michael Reffle , Xiaofeng Han , Mehrdad Ziari , Vikrant Lal , Peter W. Evans , Fred A. Kish, JR. , Donald J. Pavinski , Jie Tang , David Coult
CPC classification number: H04B10/40 , G02B6/3584 , G02B6/3598 , G02B6/366 , G02B6/4204 , G02B6/4215 , G02B6/4234 , G02B6/4246 , H04B10/503 , H04J14/06
Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.
Abstract translation: 器件可以包括衬底。 该装置可以包括安装到基板的载体。 该装置可以包括安装在载体上的发射器光子集成电路（PIC）。 发射器PIC可以包括当电压或电流施加到多个激光器之一时产生光信号的多个激光器。 该器件可以包括安装到衬底的第一微机电结构（MEMS）。 第一MEMS可以包括第一组透镜。 该装置可以包括安装到基板的平面光波电路（PLC）。 PLC可以由第一MEMS的第一组透镜光耦合到多个激光器。 该装置可以包括安装到基板的第二MEMS，其可以包括第二组透镜，其可被配置为将PLC光耦合到光纤。
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公开(公告)号：US11226448B2
公开(公告)日：2022-01-18
申请号：US15192096
申请日：2016-06-24
Applicant: Infinera Corporation
Inventor： Peter Weindel Evans , Pavel Viktorovich Studenkov , Mehrdad Ziari , Matthias Kuntz
Abstract: A photonic integrated circuit is provided that may include a substrate; one or more optical sources, on the substrate, to output light associated with a corresponding one or more optical signals; one or more waveguides connected to the one or more optical sources; a multiplexer connected to the one or more waveguides; and one or more light absorptive structures, located on the substrate adjacent to one of the one or more optical sources, one of the one or more waveguides, and/or the multiplexer, to absorb a portion of the light associated with at least one of the corresponding one or more optical signals.
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公开(公告)号：US10707965B2
公开(公告)日：2020-07-07
申请号：US16241625
申请日：2019-01-07
Applicant: Infinera Corporation
Inventor： Timothy Butrie , Michael Reffle , Xiaofeng Han , Mehrdad Ziari , Vikrant Lal , Peter W. Evans , Fred A. Klsh, Jr. , Donald J. Pavinski , Jie Tang , David Coult
Abstract: A device may include a substrate. The device may include a carrier mounted to the substrate. The device may include a transmitter photonic integrated circuit (PIC) mounted on the carrier. The transmitter PIC may include a plurality of lasers that generate an optical signal when a voltage or current is applied to one of the plurality of lasers. The device may include a first microelectromechanical structure (MEMS) mounted to the substrate. The first MEMS may include a first set of lenses. The device may include a planar lightwave circuit (PLC) mounted to the substrate. The PLC may be optically coupled to the plurality of lasers by the first set of lenses of the first MEMS. The device may include a second MEMS, mounted to the substrate, that may include a second set of lenses, which may be configured to optically couple the PLC to an optical fiber.
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Patent Agency Ranking
公开(公告)号：US20190089476A1
公开(公告)日：2019-03-21
申请号：US16192032
申请日：2018-11-15
Applicant: Infinera Corporation
Inventor： Fred A. Kish, JR. , Michael Reffle , Jeffrey T. Rahn , John Osenbach , Timothy Butrie , Xiaofeng Han , Mark Missey , Mehrdad Ziari , Peter w. Evans
IPC: H04J14/02 , H04B10/50 , H04B10/079
Abstract: Consistent with the present disclosure, a photonic integrated circuit (PIC) is provided that has 2 N channels (N being an integer). The PIC is optically coupled to N optical fibers, such that each of N polarization multiplexed optical signals are transmitted over a respective one of the N optical fibers. In another example, each of the N optical fibers supply a respective one of N polarization multiplexed optical signals to the PIC for coherent detection and processing. A multiplexer and demultiplexer may be omitted from the PIC, such that the optical signals are not combined on the PIC. As a result, the transmitted and received optical signals incur less loss and amplified spontaneous emission (ASE) noise. In addition, optical taps may be more readily employed on the PIC to measure outputs of the lasers, such as widely tunable lasers (WTLs), without crossing waveguides.
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7.发明授权Light absorption and scattering devices in a photonic integrated circuit that minimize optical feedback and noise 有权在光子集成电路中的光吸收和散射器件可最大限度地减少光学反馈和噪声公开(公告)号：US09383512B2
公开(公告)日：2016-07-05
申请号：US13732163
申请日：2012-12-31
Applicant: Infinera Corporation
Inventor： Peter Weindel Evans , Pavel Viktorovich Studenkov , Mehrdad Ziari , Matthias Kuntz
CPC classification number: G02B6/12004 , G02B6/12014 , G02B6/125 , G02B6/2813 , G02B2006/12123 , G02B2006/12126 , G02B2006/12147
Abstract: A photonic integrated circuit is provided that may include a substrate; one or more optical sources, on the substrate, to output light associated with a corresponding one or more optical signals; one or more waveguides connected to the one or more optical sources; a multiplexer connected to the one or more waveguides; and one or more light absorptive structures, located on the substrate adjacent to one of the one or more optical sources, one of the one or more waveguides, and/or the multiplexer, to absorb a portion of the light associated with at least one of the corresponding one or more optical signals.
Abstract translation: 提供了一种可包括衬底的光子集成电路; 一个或多个光源，在基板上，以输出与相应的一个或多个光信号相关联的光; 连接到所述一个或多个光源的一个或多个波导; 连接到所述一个或多个波导的多路复用器; 以及一个或多个光吸收结构，其位于与所述一个或多个光源中的一个或多个光源之一相邻的所述衬底上，所述一个或多个波导中的一个和/或所述多路复用器，以吸收与以下中的至少一个相关联的光的一部分： 对应的一个或多个光信号。
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公开(公告)号：US20240291568A1
公开(公告)日：2024-08-29
申请号：US18400542
申请日：2023-12-29
Applicant: Infinera Corporation
Inventor： Vikrant Lal , Peter Evans , David Henry Welch , Mehrdad Ziari , Scott Corzine , Thomas Frost
CPC classification number: H04B10/503 , H01S5/0262 , H01S5/0265 , H04B10/541
Abstract: Consistent with the present disclosure, a transceiver is implemented as a photonic integrated circuit (PIC) that includes a transmitter and a receiver. A laser is also provided that provides light to a splitter, which supplies a first portion of the light to the transmitter and a second power of the light to the receiver. Semiconductor optical amplifiers (SOAs) are provided at one or more locations on the PIC. In one example, at least one SOA is provided in the transmitter so that the transmitted optical signal has a desired power, and at least another SOA is provided in the receiver so that the local oscillator signal has a desired power. In a further example, an SOA is provided in the receiver to boost the power of the received optical signal. Preferably, the transceiver, including the SOAs, is monolithically integrated on a substrate, such as a substrate including indium phosphide (InP). Moreover, the SOA can be readily controlled via a low voltage current source consuming minimal electrical power.
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公开(公告)号：US20240291567A1
公开(公告)日：2024-08-29
申请号：US18400572
申请日：2023-12-29
Applicant: Infinera Corporation
Inventor： Daniel Semrau , Peter Evans , Mehrdad Ziari
CPC classification number: H04B10/43 , G02B6/12004 , H01S5/0262 , H04B10/60 , G02B2006/12142
Abstract: Consistent with the present disclosure, a transceiver is implemented as a photonic integrated circuit (PIC) that includes a transmitter and a receiver. A laser is also provided that provides light to a splitter, which supplies a first portion of the light to the transmitter and a second power of the light to the receiver. Semiconductor optical amplifiers (SOAs) are provided at one or more locations on the PIC. In one example, at least one SOA is provided in the transmitter so that the transmitted optical signal has a desired power, and at least another SOA is provided in the receiver so that the local oscillator signal has a desired power. In a further example, an SOA is provided in the receiver to boost the power of the received optical signal. Preferably, the transceiver, including the SOAs, is monolithically integrated on a substrate, such as a substrate including indium phosphide (InP). Moreover, the SOA can be readily controlled via a low voltage current source consuming minimal electrical power.
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公开(公告)号：US20240288749A1
公开(公告)日：2024-08-29
申请号：US18400550
申请日：2023-12-29
Applicant: Infinera Corporation
Inventor： Vikrant Lal , Peter Evans , David Welch , Mehrdad Ziari , Scott Corzine , Thomas Frost
CPC classification number: G02F1/395 , G02B6/126 , G02F1/212 , G02B2006/12061 , G02B2006/12121
Abstract: Consistent with the present disclosure, a transceiver is implemented as a photonic integrated circuit (PIC) that includes a transmitter and a receiver. A laser is also provided that provides light to a splitter, which supplies a first portion of the light to the transmitter and a second power of the light to the receiver. Semiconductor optical amplifiers (SOAs) are provided at one or more locations on the PIC. In one example, at least one SOA is provided in the transmitter so that the transmitted optical signal has a desired power, and at least another SOA is provided in the receiver so that the local oscillator signal has a desired power. In a further example, an SOA is provided in the receiver to boost the power of the received optical signal. Preferably, the transceiver, including the SOAs, is monolithically integrated on a substrate, such as a substrate including indium phosphide (InP). Moreover, the SOA can be readily controlled via a low voltage current source consuming minimal electrical power.
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