公开(公告)号：US20190080980A1

公开(公告)日：2019-03-14

申请号：US16124336

申请日：2018-09-07

申请人： Infineon Technologies Austria AG

发明人： Ralf Otremba ,  Markus Dinkel ,  Ulrich Froehler ,  Josef Hoeglauer ,  Uwe Kirchner ,  Guenther Lohmann ,  Klaus Schiess ,  Xaver Schloegel

IPC分类号： H01L23/367 ,  H01L23/495 ,  H01L21/56

CPC分类号： H01L23/367 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49555

摘要： A package encloses a power semiconductor die and has a package body with a package top side, package footprint side and package sidewalls. The die has first and second load terminals and blocks a blocking voltage between the load terminals. The package further includes: a lead frame structure for electrically and mechanically coupling the package to a support, the lead frame structure including an outside terminal extending out of the package footprint side and/or out of one of the package sidewalls and electrically connected with the first load terminal; a top layer arranged at the package top side and electrically connected with the second load terminal; and a heat spreader arranged external of the package body and in electrical contact with the top layer. A top surface of the heat spreader has an area greater than the area of the bottom surface.

公开(公告)号：US09748116B2

公开(公告)日：2017-08-29

申请号：US15200120

申请日：2016-07-01

申请人： Infineon Technologies Austria AG

发明人： Ralf Otremba ,  Ulrich Froehler ,  Felix Grawert ,  Ernst Katzmaier ,  Uwe Kirchner ,  Rene Mente ,  Andreas Schloegl ,  Uwe Wahl

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L23/373

CPC分类号： H01L21/56 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3737 ,  H01L23/49562 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2924/00014

摘要： Various embodiments provide an electronic device, wherein the electronic device comprises a mounting surface configured to mount the electronic device to an external structure and having a first size; a backside electrode having a second size and having arranged thereon a die electrically connected to the backside electrode; wherein the first size is at least three times the second size.

公开(公告)号：US10566260B2

公开(公告)日：2020-02-18

申请号：US16124336

申请日：2018-09-07

申请人： Infineon Technologies Austria AG

发明人： Ralf Otremba ,  Markus Dinkel ,  Ulrich Froehler ,  Josef Hoeglauer ,  Uwe Kirchner ,  Guenther Lohmann ,  Klaus Schiess ,  Xaver Schloegel

IPC分类号： H01L23/367 ,  H01L23/495 ,  H01L21/56 ,  H01L23/433 ,  H01L23/31

摘要： A package encloses a power semiconductor die and has a package body with a package top side, package footprint side and package sidewalls. The die has first and second load terminals and blocks a blocking voltage between the load terminals. The package further includes: a lead frame structure for electrically and mechanically coupling the package to a support, the lead frame structure including an outside terminal extending out of the package footprint side and/or out of one of the package sidewalls and electrically connected with the first load terminal; a top layer arranged at the package top side and electrically connected with the second load terminal; and a heat spreader arranged external of the package body and in electrical contact with the top layer. A top surface of the heat spreader has an area greater than the area of the bottom surface.

公开(公告)号：US10903133B2

公开(公告)日：2021-01-26

申请号：US16737025

申请日：2020-01-08

申请人： Infineon Technologies Austria AG

发明人： Ralf Otremba ,  Markus Dinkel ,  Ulrich Froehler ,  Josef Hoeglauer ,  Uwe Kirchner ,  Guenther Lohmann ,  Klaus Schiess ,  Xaver Schloegel

IPC分类号： H01L23/367 ,  H01L23/433 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

摘要： A package encloses a power semiconductor die and has a package body with a top side, footprint side and sidewalls. The die has first and second load terminals and blocks a blocking voltage between the load terminals. The package further includes: a lead frame structure for electrically and mechanically coupling the package to a support, the lead frame structure including an outside terminal extending out of the package footprint side and/or out of one of the package sidewalls and electrically connected with the first load terminal; and a top layer arranged at the package top side and electrically connected with the second load terminal. A heat spreader is mounted onto the top layer with a bottom surface facing the top layer. The area of the top surface of the heat spreader is greater than the area of the bottom surface.