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1.发明授权Interposer with programmable matrix for realizing configurable vertical semiconductor package arrangements 有权具有可编程矩阵的插入器，用于实现可配置的垂直半导体封装布置公开(公告)号：US09490199B2
公开(公告)日：2016-11-08
申请号：US14194916
申请日：2014-03-03
Applicant: Infineon Technologies AG
Inventor： Theng Chao Long , Tian San Tan , Wan Yee Ng , Kong Sin Chong
IPC: H01L23/498 , H01L25/065 , H01L23/00
CPC classification number: H01L23/49844 , H01L24/36 , H01L24/37 , H01L24/40 , H01L25/0657 , H01L25/105 , H01L2224/04105 , H01L2224/0603 , H01L2224/371 , H01L2224/40245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2225/1017 , H01L2225/1035 , H01L2225/107 , H01L2924/12042 , H01L2924/13091 , H01L2924/15331 , H01L2924/15333 , H01L2924/181 , H05K1/0287 , H05K1/029 , H05K1/181 , H05K2201/0305 , H05K2201/10378 , H05K2201/10515 , H05K2203/173 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: An interposer for establishing a vertical connection between semiconductor packages includes an electrically insulating substrate having a first main side and a second main side opposite the first main side, a plurality of first electrical conductors at the first main side of the substrate, a plurality of second electrical conductors at the second main side of the substrate, and a programmable connection matrix at one or both main sides of the substrate. The programmable connection matrix includes programmable junctions configured to open or close electrical connections between different ones of the first electrical conductors and different ones of the second electrical conductors upon programming of the junctions.
Abstract translation: 用于在半导体封装之间建立垂直连接的插入件包括具有第一主侧和与第一主侧相对的第二主侧的电绝缘基板，在基板的第一主侧的多个第一电导体，多个第二主体 在基板的第二主侧的电导体和在基板的一个或两个主侧的可编程连接矩阵。 可编程连接矩阵包括被配置为在编程接合点时打开或闭合不同的第一电导体和不同的第二电导体之间的电连接的可编程结。
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2.发明申请Interposer with Programmable Matrix for Realizing Configurable Vertical Semiconductor Package Arrangements 有权具有可编程矩阵的插入器，用于实现可配置的垂直半导体封装布置公开(公告)号：US20150249047A1
公开(公告)日：2015-09-03
申请号：US14194916
申请日：2014-03-03
Applicant: Infineon Technologies AG
Inventor： Theng Chao Long , Tian San Tan , Wan Yee Ng , Kong Sin Chong
IPC: H01L23/498 , H01L25/065
CPC classification number: H01L23/49844 , H01L24/36 , H01L24/37 , H01L24/40 , H01L25/0657 , H01L25/105 , H01L2224/04105 , H01L2224/0603 , H01L2224/371 , H01L2224/40245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2225/1017 , H01L2225/1035 , H01L2225/107 , H01L2924/12042 , H01L2924/13091 , H01L2924/15331 , H01L2924/15333 , H01L2924/181 , H05K1/0287 , H05K1/029 , H05K1/181 , H05K2201/0305 , H05K2201/10378 , H05K2201/10515 , H05K2203/173 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: An interposer for establishing a vertical connection between semiconductor packages includes an electrically insulating substrate having a first main side and a second main side opposite the first main side, a plurality of first electrical conductors at the first main side of the substrate, a plurality of second electrical conductors at the second main side of the substrate, and a programmable connection matrix at one or both main sides of the substrate. The programmable connection matrix includes programmable junctions configured to open or close electrical connections between different ones of the first electrical conductors and different ones of the second electrical conductors upon programming of the junctions.
Abstract translation: 用于在半导体封装之间建立垂直连接的插入件包括具有第一主侧和与第一主侧相对的第二主侧的电绝缘基板，在基板的第一主侧的多个第一电导体，多个第二主体 在基板的第二主侧的电导体和在基板的一个或两个主侧的可编程连接矩阵。 可编程连接矩阵包括被配置为在编程接合点时打开或闭合不同的第一电导体和不同的第二电导体之间的电连接的可编程结。
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