公开(公告)号：US20040197988A1

公开(公告)日：2004-10-07

申请号：US10722360

申请日：2003-11-26

Applicant: Infineon Technologies AG

Inventor： Lars Heineck ,  Stephan Kudelka ,  Jorn Lutzen ,  Hans-Peter Moll ,  Martin Popp ,  Till Schlosser ,  Johann Steinmetz

IPC: H01L021/8242 ,  H01L021/20

CPC classification number: H01L27/10867 ,  H01L27/10829 ,  H01L29/66181 ,  H01L29/945

Abstract: A method for fabricating a trench capacitor with an insulation collar in a substrate, which is electrically connected to the substrate on one side via a buried contact, using a hard mask with a corresponding mask opening.

Abstract translation: 一种在衬底中制造具有绝缘套环的沟槽电容器的方法，其使用具有相应掩模开口的硬掩模经由掩埋触点将其一侧的衬底电连接。