专利检索 ap:("Infineon Technologies AG") AND inv:"Alfred Swain Hong Yeo" 第 1 页

1.

发明授权
Three-dimensional stack of leaded package and electronic member 有权

公开(公告)号：US09698083B2

公开(公告)日：2017-07-04

申请号：US14727554

申请日：2015-06-01

申请人： Infineon Technologies AG

发明人： Alfred Swain Hong Yeo

IPC分类号： H01R9/00 , H01L23/495 , H01L21/56 , H01L25/16 , H05K1/18 , H05K3/34 , H01L23/31

CPC分类号： H01L23/49531 , H01L21/56 , H01L23/3107 , H01L23/495 , H01L23/49555 , H01L23/49589 , H01L25/16 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H05K1/18 , H05K3/3426 , H05K2201/10515 , H05K2201/10522 , H05K2201/1053 , H05K2201/10689 , H05K2201/10765 , H05K2201/10772 , H05K2201/10962 , Y02P70/613 , Y10T29/4913 , H01L2924/00012 , H01L2924/00014

摘要： An electronic device comprising a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier lead for mounting the package on and electrically connecting the electronic chip to a carrier, and at least one at least partially exposed electrically conductive connection lead, and an electronic member stacked with the package so as to be mounted on and electrically connected to the package by the at least one connection lead.