公开(公告)号：US20250164981A1

公开(公告)日：2025-05-22

申请号：US18951650

申请日：2024-11-19

Applicant: Industrial Technology Research Institute

Inventor： Shih-Chin Lin ,  Wen-Jun Chen ,  Ching-Chiun Wang ,  Chih-Ming Ho ,  Da-Jeng Yao

IPC: G05B19/418 ,  C23C14/54 ,  C23C16/52

Abstract: An optimization method for a vacuum plating process includes following steps. A property of a thin film to be optimized is determined. According to the property of the thin film to be optimized, process parameters and a level of each of the process parameters are determined. M sets of experiments are designed, where M is a positive integer, M is positively related to a number of the process parameters, but M is not related to a number of the level of the process parameters. The M sets of experiments are performed to obtain M sets of test films and the property of each of the test films are measured or calculated. Process parameters used in the M sets of experiments and the property of the M sets of test films are fitted with a multi-dimensional quadratic transformation function to obtain a first fitting function. The first fitting function is dynamically modified using an iteration method to obtain a best fitting function. A multi-dimensional response surface diagram is illustrated using the best fitting function to determine an optimal process parameter combination.