知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.022 秒)

    LIGHT SOURCE ASSEMBLY USING LIGHT EMITTING DIODES AND REFLECTIVE SHEET SET
    1.
    发明申请
    LIGHT SOURCE ASSEMBLY USING LIGHT EMITTING DIODES AND REFLECTIVE SHEET SET 失效
    光源组件使用发光二极管和反射片组

    公开(公告)号：US20100067220A1

    公开(公告)日：2010-03-18

    申请号：US12556123

    申请日：2009-09-09

    申请人： KUAN HER CHIU ,  IRENE CHEN ,  JIAN SHIHN TSANG

    发明人： KUAN HER CHIU ,  IRENE CHEN ,  JIAN SHIHN TSANG

    IPC分类号： G02F1/13357 ,  F21V7/00

    CPC分类号： G02F1/133603 ,  G02F1/133605 ,  H05K1/0274 ,  H05K2201/10106 ,  H05K2201/2054

    摘要： A light source assembly comprises a plurality of reflective sheets, a plurality of light emitting diodes and a printed circuit board. Each reflective sheet comprises a plate member and a plurality of openings formed on the plate member. The plurality of light emitting diodes are mounted on the printed circuit board. The plurality of reflective sheets are also mounted on the printed circuit board. The plurality of light emitting diodes are respectively located in the openings. The light emitted from the light emitting diodes is reflected by the surface of the plate member.

    摘要翻译： 光源组件包括多个反射片，多个发光二极管和印刷电路板。 每个反射片包括板构件和形成在板构件上的多个开口。 多个发光二极管安装在印刷电路板上。 多个反射片也安装在印刷电路板上。 多个发光二极管分别位于开口中。 从发光二极管发出的光被板状部件的表面反射。

    LIGHT EMITTING DIODE ARRAY, DRIVING SYSTEM THEREOF AND LIQUID CRYSTAL DISPLAY USING THE SAME
    2.
    发明申请
    LIGHT EMITTING DIODE ARRAY, DRIVING SYSTEM THEREOF AND LIQUID CRYSTAL DISPLAY USING THE SAME 审中-公开
    发光二极体阵列，驱动系统及使用其的液晶显示

    公开(公告)号：US20100103091A1

    公开(公告)日：2010-04-29

    申请号：US12607387

    申请日：2009-10-28

    申请人： IRENE CHEN ,  KUAN HER CHIU ,  JIAN SHIHN TSANG

    发明人： IRENE CHEN ,  KUAN HER CHIU ,  JIAN SHIHN TSANG

    IPC分类号： G09G3/36

    CPC分类号： G09G3/3406 ,  G09G3/3611 ,  G09G2320/0233 ,  G09G2320/064

    摘要： A light emitting diode array for a liquid crystal display comprises a plurality of first light emitting diodes that are driven by pulse-width modulated signals and a plurality of second light emitting diodes that are driven by constant direct current. The plurality of first light emitting diodes and the plurality of second light emitting diodes are arranged in an alternating manner for adjustment of the uniform illumination of a liquid crystal display.

    摘要翻译： 用于液晶显示器的发光二极管阵列包括由脉冲宽度调制信号驱动的多个第一发光二极管和由恒定直流电驱动的多个第二发光二极管。 多个第一发光二极管和多个第二发光二极管以交替的方式布置，用于调节液晶显示​​器的均匀照明。

    LIGHT EMITTING DIODE DEVICE AND BACKLIGHT MODULE USING THE SAME
    3.
    发明申请
    LIGHT EMITTING DIODE DEVICE AND BACKLIGHT MODULE USING THE SAME 审中-公开
    发光二极管装置和使用相同的背光模块

    公开(公告)号：US20100002465A1

    公开(公告)日：2010-01-07

    申请号：US12496969

    申请日：2009-07-02

    申请人： JIAN SHIHN TSANG ,  IRENE CHEN

    发明人： JIAN SHIHN TSANG ,  IRENE CHEN

    IPC分类号： F21V7/04 ,  H01L33/00

    CPC分类号： H01L33/54 ,  G02B6/0021 ,  G02B6/0023 ,  G02B6/003 ,  H01L2224/48091 ,  H01L2924/1815 ,  H01L2924/00014

    摘要： A light emitting diode (LED) device comprises a substrate, an LED chip and an encapsulation body. The LED chip is mounted on the substrate, and the encapsulation body is overlaid on the LED chip and the substrate. The encapsulation body includes a light output surface. The light output surface can uniformly diffuse emission light over a wide angle in a first direction and concentrate the emission light in a second direction perpendicular to the first direction.

    摘要翻译： 发光二极管（LED）装置包括基板，LED芯片和封装体。 LED芯片安装在基板上，并且封装体覆盖在LED芯片和基板上。 封装体包括光输出表面。 光输出表面可以在第一方向上以广角均匀地漫射发射光，并将发射光集中在垂直于第一方向的第二方向上。

    PACKAGE STRUCTURE OF PHOTOELECTRONIC DEVICE AND FABRICATING METHOD THEREOF
    4.
    发明申请
    PACKAGE STRUCTURE OF PHOTOELECTRONIC DEVICE AND FABRICATING METHOD THEREOF 有权
    光电器件的封装结构及其制造方法

    公开(公告)号：US20090078956A1

    公开(公告)日：2009-03-26

    申请号：US12255165

    申请日：2008-10-21

    申请人： WEN LIANG TSENG ,  LUNG HSIN CHEN ,  JIAN SHIHN TSANG

    发明人： WEN LIANG TSENG ,  LUNG HSIN CHEN ,  JIAN SHIHN TSANG

    IPC分类号： H01L21/50 ,  H01L33/00

    CPC分类号： H01L33/641 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A package structure for photoelectronic devices comprises a silicon substrate, a first insulating layer, a reflective layer, a second insulating layer, a first conductive layer, a second conductive layer and a die. The silicon substrate has a first surface and a second surface, wherein the first surface is opposed to the second surface. The first surface has a reflective opening, and the second surface has at least two electrode via holes connected to the reflective opening and a recess disposed outside the electrode via holes. The first insulating layer overlays the first surface, the second surface and the recesses. The reflective layer is disposed on the reflective opening. The second insulating layer is disposed on the reflective layer. The first conductive layer is disposed on the surface of the second insulating layer. The second conductive layer is disposed on the surface of the second surface and inside the electrode via holes. The die is fixed inside the reflective opening and electrically connected to the first conductive layer.

    摘要翻译： 光电器件的封装结构包括硅衬底，第一绝缘层，反射层，第二绝缘层，第一导电层，第二导电层和裸片。 硅衬底具有第一表面和第二表面，其中第一表面与第二表面相对。 第一表面具有反射开口，并且第二表面具有连接到反射开口的至少两个电极通孔和设置在电极通孔外部的凹部。 第一绝缘层覆盖第一表面，第二表面和凹槽。 反射层设置在反射开口上。 第二绝缘层设置在反射层上。 第一导电层设置在第二绝缘层的表面上。 第二导电层设置在第二表面的表面和电极通孔的内部。 模具固定在反射开口内并电连接到第一导电层。

    PACKAGE STRUCTURE OF PHOTOELECTRONIC DEVICE AND FABRICATING METHOD THEREOF
    5.
    发明申请
    PACKAGE STRUCTURE OF PHOTOELECTRONIC DEVICE AND FABRICATING METHOD THEREOF 审中-公开
    光电器件的封装结构及其制造方法

    公开(公告)号：US20110169034A1

    公开(公告)日：2011-07-14

    申请号：US13069399

    申请日：2011-03-23

    申请人： WEN LIANG TSENG ,  LUNG HSIN CHEN ,  JIAN SHIHN TSANG

    发明人： WEN LIANG TSENG ,  LUNG HSIN CHEN ,  JIAN SHIHN TSANG

    IPC分类号： H01L33/60

    CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A package structure includes a silicon substrate, a first insulating layer, a reflective layer, a second insulating layer, a first conductive layer, a second conductive layer and a die. The silicon substrate has a first surface and an opposite second surface. The first surface has a reflective opening, and the second surface has two electrode via holes connected to the reflective opening and a recess disposed outside the electrode via holes. The first insulating layer overlays the first surface, the second surface and the recess. The reflective layer is disposed on the reflective opening. The second insulating layer is disposed on the reflective layer. The first conductive layer is disposed on the second insulating layer. The second conductive layer is disposed on the second surface and inside the electrode via holes. The die is fixed inside the reflective opening and electrically connected to the first conductive layer.

    摘要翻译： 封装结构包括硅衬底，第一绝缘层，反射层，第二绝缘层，第一导电层，第二导电层和管芯。 硅衬底具有第一表面和相对的第二表面。 第一表面具有反射开口，第二表面具有连接到反射开口的两个电极通孔和设置在电极通孔外部的凹部。 第一绝缘层覆盖第一表面，第二表面和凹槽。 反射层设置在反射开口上。 第二绝缘层设置在反射层上。 第一导电层设置在第二绝缘层上。 第二导电层设置在电极通孔的第二表面和内部。 模具固定在反射开口内并电连接到第一导电层。