公开(公告)号：US10204893B2

公开(公告)日：2019-02-12

申请号：US15159649

申请日：2016-05-19

申请人： INVENSAS BONDING TECHNOLOGIES, INC.

发明人： Cyprian Emeka Uzoh ,  Arkalgud R. Sitaram ,  Paul Enquist

IPC分类号： H01L25/00 ,  H01L21/308 ,  H01L25/065 ,  H01L21/304 ,  H01L21/683 ,  H01L21/306 ,  H01L23/31 ,  H01L21/56

摘要： In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.

公开(公告)号：US20210183847A1

公开(公告)日：2021-06-17

申请号：US17131329

申请日：2020-12-22

申请人： INVENSAS BONDING TECHNOLOGIES, INC.

发明人： Cyprian Emeka Uzoh ,  Arkalgud R. Sitaram ,  Paul Enquist

IPC分类号： H01L25/00 ,  H01L23/31 ,  H01L21/56 ,  H01L21/304 ,  H01L21/306 ,  H01L21/308 ,  H01L21/683 ,  H01L25/065

摘要： In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.

公开(公告)号：US20190189607A1

公开(公告)日：2019-06-20

申请号：US16270466

申请日：2019-02-07

申请人： INVENSAS BONDING TECHNOLOGIES, INC.

发明人： Cyprian Emeka Uzoh ,  Arkalgud R. Sitaram ,  Paul Enquist

IPC分类号： H01L25/00 ,  H01L25/065 ,  H01L21/683 ,  H01L21/308 ,  H01L21/56 ,  H01L23/31 ,  H01L21/304 ,  H01L21/306

CPC分类号： H01L25/50 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3081 ,  H01L21/561 ,  H01L21/683 ,  H01L23/3121 ,  H01L23/3135 ,  H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/351

摘要： In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.