Invention Grant
- Patent Title: Stacked dies and methods for forming bonded structures
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Application No.: US15159649Application Date: 2016-05-19
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Publication No.: US10204893B2Publication Date: 2019-02-12
- Inventor: Cyprian Emeka Uzoh , Arkalgud R. Sitaram , Paul Enquist
- Applicant: INVENSAS BONDING TECHNOLOGIES, INC.
- Applicant Address: US CA San Jose
- Assignee: Invensas Bonding Technologies, Inc.
- Current Assignee: Invensas Bonding Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L21/308 ; H01L25/065 ; H01L21/304 ; H01L21/683 ; H01L21/306 ; H01L23/31 ; H01L21/56
Abstract:
In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first integrated device die. At least a portion of the first layer can be removed. A second integrated device die can be directly bonded to the first integrated device die without an intervening adhesive.
Public/Granted literature
- US20170338214A1 STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES Public/Granted day:2017-11-23
Information query
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