-
公开(公告)号：US11211242B2
公开(公告)日：2021-12-28
申请号：US16684453
申请日：2019-11-14
摘要： A cleaning material, device, and method for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, in which the cleaning pad has a predetermined configuration appropriate for the particular pin contact elements and a substrate having a defined functionalized surface topology and geometry which can be introduced into the testing apparatus during the normal testing operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
-
2.发明授权公开(公告)号：US11318550B2
公开(公告)日：2022-05-03
申请号：US16855841
申请日：2020-04-22
发明人： Alan E. Humphrey , Jerry J. Broz , Bret A. Humphrey , Alex S. Poles , Wayne C. Smith , Janakraj Shivlal
摘要： A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
-
3.发明申请公开(公告)号：US20210146464A1
公开(公告)日：2021-05-20
申请号：US16855841
申请日：2020-04-22
发明人： Alan E. Humphrey , Jerry J. Broz , Bret A. Humphrey , Alex S. Poles , Wayne C. Smith , Janakraj Shivlal
摘要： A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
-
-
搜索结果
3 条记录 (耗时 0.014 秒)
