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公开(公告)号：US11756811B2
公开(公告)日：2023-09-12
申请号：US16460929
申请日：2019-07-02
IPC分类号： H01L21/67 , B65G47/91 , B08B1/02 , B08B7/00 , H01L21/683
CPC分类号： H01L21/67144 , B08B1/02 , B08B7/0028 , B65G47/91 , H01L21/6838
摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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公开(公告)号：US20210001378A1
公开(公告)日：2021-01-07
申请号：US16460918
申请日：2019-07-02
摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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3.发明授权公开(公告)号：US10195648B2
公开(公告)日：2019-02-05
申请号：US14445003
申请日：2014-07-28
摘要： A cleaning material for predictably cleaning the contact elements and support hardware of a tester interface, such as a probe card and a test socket, has a cleaning pad layer, one or more intermediate layers having a set of predetermined characteristics and having a plurality of abrasive particles.
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4.发明申请公开(公告)号：US20210146464A1
公开(公告)日：2021-05-20
申请号：US16855841
申请日：2020-04-22
发明人： Alan E. Humphrey , Jerry J. Broz , Bret A. Humphrey , Alex S. Poles , Wayne C. Smith , Janakraj Shivlal
摘要： A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
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公开(公告)号：US20210005499A1
公开(公告)日：2021-01-07
申请号：US16460877
申请日：2019-07-02
IPC分类号： H01L21/683 , B08B1/02
摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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公开(公告)号：US20180071798A1
公开(公告)日：2018-03-15
申请号：US15818386
申请日：2017-11-20
IPC分类号： B08B7/00
CPC分类号： B08B7/0028 , B08B1/007 , G01R3/00
摘要： A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.
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7.发明授权公开(公告)号：US11318550B2
公开(公告)日：2022-05-03
申请号：US16855841
申请日：2020-04-22
发明人： Alan E. Humphrey , Jerry J. Broz , Bret A. Humphrey , Alex S. Poles , Wayne C. Smith , Janakraj Shivlal
摘要： A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
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8.发明授权公开(公告)号：US11035898B1
公开(公告)日：2021-06-15
申请号：US16872292
申请日：2020-05-11
发明人： Alan E. Humphrey , Jerry J. Broz , Wayne C. Smith , Mark M. Stark
摘要： A thermally conductive material, device, and method for predictably maintaining the temperature state and condition of the contact elements and support hardware of a tester interface, such as a probe card, for a testing apparatus, such as automated test equipment (ATE), that has a predetermined configuration applicable for the particular pin contact elements, thermal conditions. The thermally conductive device also has a substrate having a predefined form factor which can be readily introduced into the testing apparatus during normal testing operations. Unlike a patterned substrate that is constrained to specific probe element layouts, the unpatterned surface of the heat conductive device facilitates use with multiple probe card designs within numerous automated test equipment (ATE) tools.
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公开(公告)号：US20210005483A1
公开(公告)日：2021-01-07
申请号：US16460929
申请日：2019-07-02
摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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公开(公告)号：US10792713B1
公开(公告)日：2020-10-06
申请号：US16460935
申请日：2019-07-02
摘要： A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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