公开(公告)号：US20230207424A1

公开(公告)日：2023-06-29

申请号：US18145231

申请日：2022-12-22

Applicant: Intel Corporation

Inventor： Linghe Sui ,  Jun Liu ,  Jiancheng Tao ,  Tao Wang ,  Chunlin Bai ,  Hongjun She ,  Dengfeng Huang

IPC: H01L23/427 ,  H01L25/18

CPC classification number: H01L23/427 ,  H01L25/18

Abstract: A vapor chamber architecture for multiple cavity/heat source system designs. The vapor chamber architecture can be customized in dimensions to cool two or more spatially separated, and potentially heterogeneous, heat sources in a system floor plan. The vapor chamber architecture can additionally be customized to concurrently manage the cooling requirements for the two or more heat sources that have different power consumptions and sizes. The provided vapor chamber architecture can be manufactured using etching processes, additive manufacturing processes, or the like.

公开(公告)号：US20150169938A1

公开(公告)日：2015-06-18

申请号：US14106134

申请日：2013-12-13

Applicant: Intel Corporation

Inventor： Anbang Yao ,  Yangzhou Du ,  Xiaofeng Tong ,  Tao Wang ,  Yurong Chen ,  Jianguo Li ,  Jianbo Ye ,  Wenlong Li ,  Yimin Zhang

IPC: G06K9/00

CPC classification number: G06K9/00261 ,  G06K9/00281 ,  G06K9/00315 ,  G06K9/6207

Abstract: Disclosed in some examples are various modifications to the shape regression technique for use in real-time applications, and methods, systems, and machine readable mediums which utilize the resulting facial landmark tracking methods.

Abstract translation: 在一些示例中公开了对用于实时应用的形状回归技术的各种修改，以及利用所得到的面部地标跟踪方法的方法，系统和机器可读介质。

公开(公告)号：US20230280793A1

公开(公告)日：2023-09-07

申请号：US18117887

申请日：2023-03-06

Applicant: Intel Corporation

Inventor： Min Liu ,  Lakshman Krishnamurthy ,  David L. Graumann ,  Jameson H. Williams ,  Miriam K. Selvaraj ,  Bryan R. Peebler ,  Wendy A. March ,  Brian K. Vogel ,  Wenbo Shen ,  Sihua Tian ,  Lijuan Xiao ,  Tao Wang ,  Xiaoyan Dang ,  Nithyananda S. Jeganathan ,  Sunil A. Kulkarni ,  Sherman Chan Wai Lee ,  Kaining Yuan

IPC: G06F1/16 ,  G06F3/04815 ,  G06F3/04883 ,  G06F3/044 ,  G06F3/04842 ,  G06F3/0488

CPC classification number: G06F1/1656 ,  G06F3/044 ,  G06F3/0445 ,  G06F3/04815 ,  G06F3/04842 ,  G06F3/0488 ,  G06F3/04883 ,  G06F2200/1636 ,  G06F2203/04101 ,  G06F2203/04808

Abstract: A device includes an enclosure and logic. The enclosure includes a plurality of capacitive touch sensor arrays disposed at least on two of a top side, a bottom side, a left side, a right side, a front side, and a back side of the device. The enclosure also includes a first display on the front side of the device. The logic receives touch interaction information from the plurality of capacitive touch sensor arrays and initiates an action based at least in part on the touch interaction information.

公开(公告)号：USD829249S1

公开(公告)日：2018-09-25

申请号：US29610323

申请日：2017-07-11

Applicant: Intel Corporation

Designer： Tao Wang ,  Bo Kang

公开(公告)号：US09871995B2

公开(公告)日：2018-01-16

申请号：US14972821

申请日：2015-12-17

Applicant: INTEL CORPORATION

Inventor： Qiang Li ,  Wenlong Li ,  Peng Wang ,  Tao Wang ,  Yangzhou Du ,  Jianguo Li

IPC: H04N7/15 ,  H04N19/115 ,  H04N19/17 ,  H04N19/167 ,  H04N19/59

CPC classification number: H04N7/15 ,  H04N19/115 ,  H04N19/167 ,  H04N19/17 ,  H04N19/59

Abstract: Various embodiments of this disclosure may describe apparatuses, methods, and systems including an encoding engine to encode and/or compress one or more objects of interest within individual image frames with higher bit densities than the bit density employed to encode and/or compress their background. The image processing system may further include a context engine to identify a region of interest including at least a part of the one or more objects of interest, and scale the region of interest within individual image frames to emphasize the objects of interest. Other embodiments may also be disclosed or claimed.

公开(公告)号：US20160291731A1

公开(公告)日：2016-10-06

申请号：US15038657

申请日：2013-12-24

Applicant: Min LIU ,  Lakshman KRISHNAMURTHY ,  David L. GRAUman ,  Jameson H. WILLIAMS ,  Miriam K. SELVARAJ ,  Bryan R. PEEBLER ,  Wendy R. MARCH ,  Brian K. VOGEL ,  Wenbo SHEN ,  Sihua TIAN ,  Lijuan XIAO ,  Tao WANG ,  Xiaoyan DANG ,  Nithyananda S. JEGANATHAN ,  Sunil A. KUIKARNI ,  Sherman Chan Wai LEE ,  Kaining YUAN ,  INTEL CORPORATION

Inventor： Min Liu ,  Lakshman Krishnamurthy ,  David L. Graumann ,  Jameson H. Williams ,  Miriam K. Selvaraj ,  Bryan R. Peebler ,  Wendy A. March ,  Brian K. Vogel ,  Wenbo Shen ,  Sihua Tian ,  Lijuan Xiao ,  Tao Wang ,  Xiaoyan Dang ,  Nithyananda S. Jeganathan ,  Sunil A. Kulkarni ,  Chan Wai Lee ,  Kaining Yuan

IPC: G06F3/044 ,  G06F3/0488 ,  G06F3/0484

Abstract: A device includes an enclosure and logic. The enclosure includes a plurality of capacitive touch sensor arrays disposed at least on two of a top side, a bottom side, a left side, a right side, a front side, and a back side of the device. The enclosure also includes a first display on the front side of the device. The logic receives touch interaction information from the plurality of capacitive touch sensor arrays and initiates an action based at least in part on the touch interaction information.

Abstract translation: 设备包括外壳和逻辑。 外壳包括设置在设备的顶侧，底侧，左侧，右侧，前侧和后侧中的至少两个上的多个电容式触摸传感器阵列。 外壳还包括设备前侧的第一显示器。 该逻辑从多个电容式触摸传感器阵列接收触摸交互信息，并至少部分地基于触摸交互信息发起动作。

公开(公告)号：US20220057841A1

公开(公告)日：2022-02-24

申请号：US17460983

申请日：2021-08-30

Applicant: Intel Corporation

Inventor： Min Liu ,  Lakshman Krishnamurthy ,  David L. Graumann ,  Jameson H. Williams ,  Miriam K. Selvaraj ,  Bryan R. Peebler ,  Wendy A. March ,  Brian K. Vogel ,  Wenbo Shen ,  Sihua Tian ,  Lijuan Xiao ,  Tao Wang ,  Xiaoyan Dang ,  Nithyananda S. Jeganathan ,  Sunil A. Kulkarni ,  Sherman Chan Wai Lee ,  Kaining Yuan

IPC: G06F1/16 ,  G06F3/0481 ,  G06F3/0488 ,  G06F3/044 ,  G06F3/0484

Abstract: A device includes an enclosure and logic. The enclosure includes a plurality of capacitive touch sensor arrays disposed at least on two of a top side, a bottom side, a left side, a right side, a front side, and a back side of the device. The enclosure also includes a first display on the front side of the device. The logic receives touch interaction information from the plurality of capacitive touch sensor arrays and initiates an action based at least in part on the touch interaction information.

公开(公告)号：US20210132665A1

公开(公告)日：2021-05-06

申请号：US17092783

申请日：2020-11-09

Applicant: Intel Corporation

Inventor： Min Liu ,  Lakshman Krishnamurthy ,  David L. Graumann ,  Jameson H. Williams ,  Miriam K. Selvaraj ,  Bryan R. Peebler ,  Wendy A. March ,  Brian K. Vogel ,  Wenbo Shen ,  Sihua Tian ,  Lijuan Xiao ,  Tao Wang ,  Xiaoyan Dang ,  Nithyananda S. Jeganathan ,  Sunil A. Kulkarni ,  Sherman Chan Wai Lee ,  Kaining Yuan

IPC: G06F1/16 ,  G06F3/0481 ,  G06F3/0488 ,  G06F3/044 ,  G06F3/0484

Abstract: A device includes an enclosure and logic. The enclosure includes a plurality of capacitive touch sensor arrays disposed at least on two of a top side, a bottom side, a left side, a right side, a front side, and a back side of the device. The enclosure also includes a first display on the front side of the device. The logic receives touch interaction information from the plurality of capacitive touch sensor arrays and initiates an action based at least in part on the touch interaction information.

公开(公告)号：US10831318B2

公开(公告)日：2020-11-10

申请号：US15038657

申请日：2013-12-24

Applicant: Intel Corporation

Inventor： Min Liu ,  Lakshman Krishnamurthy ,  David L. Graumann ,  Jameson H. Williams ,  Miriam K. Selvaraj ,  Bryan R. Peebler ,  Wendy A. March ,  Brian K. Vogel ,  Wenbo Shen ,  Sihua Tian ,  Lijuan Xiao ,  Tao Wang ,  Xiaoyan Dang ,  Nithyananda S. Jeganathan ,  Sunil A. Kulkarni ,  Chan Wai Lee ,  Kaining Yuan

IPC: G06F3/044 ,  G06F1/16 ,  G06F3/0481 ,  G06F3/0488 ,  G06F3/0484

Abstract: A device includes an enclosure and logic. The enclosure includes a plurality of capacitive touch sensor arrays disposed at least on two of a top side, a bottom side, a left side, a right side, a front side, and a back side of the device. The enclosure also includes a first display on the front side of the device. The logic receives touch interaction information from the plurality of capacitive touch sensor arrays and initiates an action based at least in part on the touch interaction information.

公开(公告)号：US11599154B2

公开(公告)日：2023-03-07

申请号：US17460983

申请日：2021-08-30

Applicant: Intel Corporation

Inventor： Min Liu ,  Lakshman Krishnamurthy ,  David L. Graumann ,  Jameson H. Williams ,  Miriam K. Selvaraj ,  Bryan R. Peebler ,  Wendy A. March ,  Brian K. Vogel ,  Wenbo Shen ,  Sihua Tian ,  Lijuan Xiao ,  Tao Wang ,  Xiaoyan Dang ,  Nithyananda S. Jeganathan ,  Sunil A. Kulkarni ,  Sherman Chan Wai Lee ,  Kaining Yuan

IPC: G06F3/044 ,  G06F1/16 ,  G06F3/04815 ,  G06F3/04883 ,  G06F3/04842 ,  G06F3/0488

Abstract: A device includes an enclosure and logic. The enclosure includes a plurality of capacitive touch sensor arrays disposed at least on two of a top side, a bottom side, a left side, a right side, a front side, and a back side of the device. The enclosure also includes a first display on the front side of the device. The logic receives touch interaction information from the plurality of capacitive touch sensor arrays and initiates an action based at least in part on the touch interaction information.