公开(公告)号：US20190173211A1

公开(公告)日：2019-06-06

申请号：US16208543

申请日：2018-12-03

申请人： Intel Corporation

发明人： Russell Aoki ,  Aaron Gorius ,  Michael T. Crocker ,  Matthew J. Adiletta

IPC分类号： H01R12/72 ,  G06F1/18 ,  H05K1/14

摘要： Sleds for operation in racks of data centers are disclosed herein. A sled includes a circuit board substrate, one or more physical resources, and one or more memory devices. The circuit board substrate has a top side and a bottom side arranged opposite the top side. The one or more physical resources are coupled to the top side of the circuit board substrate. The one or more memory devices are coupled to the bottom side of the circuit board substrate. Additionally, the sled includes a connector to electrically couple the one or more physical resources to the one or more memory devices.

公开(公告)号：US10175806B2

公开(公告)日：2019-01-08

申请号：US14663679

申请日：2015-03-20

申请人： Intel Corporation

发明人： Jeremy Burr ,  David Browning ,  Russell Aoki ,  Saara Kamppari

IPC分类号： G06F3/041 ,  G06F1/16 ,  G09G5/00 ,  G06F3/0488

摘要： Particular embodiments described herein provide for an electronic device, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a main housing, a flexible display, and a touchscreen, wherein regions of the touchscreen can be reconfigured based on an orientation of the flexible display.

公开(公告)号：US10910746B2

公开(公告)日：2021-02-02

申请号：US16208543

申请日：2018-12-03

申请人： Intel Corporation

发明人： Russell Aoki ,  Aaron Gorius ,  Michael T. Crocker ,  Matthew J. Adiletta

IPC分类号： H01R12/00 ,  H01R12/72 ,  H05K1/14 ,  G06F1/18 ,  H05K7/18

摘要： Sleds for operation in racks of data centers are disclosed herein. A sled includes a circuit board substrate, one or more physical resources, and one or more memory devices. The circuit board substrate has a top side and a bottom side arranged opposite the top side. The one or more physical resources are coupled to the top side of the circuit board substrate. The one or more memory devices are coupled to the bottom side of the circuit board substrate. Additionally, the sled includes a connector to electrically couple the one or more physical resources to the one or more memory devices.

公开(公告)号：US20190141845A1

公开(公告)日：2019-05-09

申请号：US16220631

申请日：2018-12-14

申请人： Intel Corporation

发明人： Mani Prakash ,  Thomas T. Holden ,  Aaron Gorius ,  Michael T. Crocker ,  Matthew J. Adiletta ,  Russell Aoki

IPC分类号： H05K5/00 ,  H05K5/02 ,  H05K7/02

摘要： A configurable processor module includes a central processing unit (CPU) package mounted to a CPU substrate, which may be mounted to a circuit board substrate. The CPU substrate may include physical resources usable by the CPU package, which may not be included or duplicated on the circuit board substrate. As such, features of the CPU package that are unavailable on the circuit board substrate may be available on the CPU substrate. Additionally, the CPU substrate and physical resources may be selected and designed so as to provide varying levels of functionality across different compute devices that use the same type of CPU package.

公开(公告)号：USD810031S1

公开(公告)日：2018-02-13

申请号：US29503589

申请日：2014-09-26

申请人： INTEL CORPORATION

设计人： Mark Sprenger ,  Russell Aoki ,  David Pidwerbecki

公开(公告)号：US11291115B2

公开(公告)日：2022-03-29

申请号：US15942263

申请日：2018-03-30

申请人： Intel Corporation

发明人： Shelby A. Ferguson ,  Bijoyraj Sahu ,  Russell Aoki ,  Thomas Boyd ,  Eric W. Buddrius ,  Kevin Ceurter ,  Mustafa Haswarey ,  Rolf Laido ,  Daniel Neumann ,  Rachel Taylor ,  Anthony Valpiani

IPC分类号： H05K1/18 ,  H01L23/40 ,  H01L21/48 ,  H01R12/88 ,  H01R12/70 ,  H05K7/20 ,  H05K1/02

摘要： A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.

公开(公告)号：US20190069434A1

公开(公告)日：2019-02-28

申请号：US15859391

申请日：2017-12-30

申请人： Intel Corporation

发明人： Russell Aoki

IPC分类号： H05K7/14

摘要： Racks and rack systems to support a plurality of sleds are disclosed herein. A rack comprises an elongated support post and a plurality of support chassis. The elongated support post extends vertically. The plurality of support chassis are coupled to the elongated support post. Each support chassis of the plurality of support chassis is sized to house a corresponding sled of the plurality of sleds.

公开(公告)号：US20190067848A1

公开(公告)日：2019-02-28

申请号：US15942108

申请日：2018-03-30

申请人： Intel Corporation

发明人： Russell Aoki

IPC分类号： H01R12/70 ,  H05K7/14 ,  H05K7/20 ,  H01R12/73 ,  H01R43/20 ,  H01R43/26 ,  H05K1/11 ,  H05K1/18 ,  H01R12/71 ,  H01R12/72 ,  G02B6/35

摘要： Sleds for operation in racks of data centers are disclosed herein. A sled includes a circuit board substrate, one or more physical resources, and one or more memory devices. The circuit board substrate has a top side and a bottom side arranged opposite the top side. The one or more physical resources are coupled to the top side of the circuit board substrate. The one or more memory devices are coupled to the bottom side of the circuit board substrate. Additionally, the sled includes a connector to electrically couple the one or more physical resources to the one or more memory devices.

公开(公告)号：US09766661B2

公开(公告)日：2017-09-19

申请号：US14126242

申请日：2013-07-30

申请人： Intel Corporation

发明人： Michael Hui ,  Russell Aoki ,  Anthony P. Valpiani ,  Nicolas A. Kurczewski

IPC分类号： G06F1/16

CPC分类号： G06F1/1654 ,  G06F1/1643 ,  G06F1/166 ,  G06F1/1683

摘要： Particular embodiments described herein provide for an electronic device that could include a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a display portion and a keyboard portion that includes a cradle dock to allow the display portion to be removably connected to the keyboard portion in a first configuration, where a viewing angle of the display portion can be adjusted.

公开(公告)号：US20160274718A1

公开(公告)日：2016-09-22

申请号：US14663679

申请日：2015-03-20

申请人： Intel Corporation

发明人： Jeremy Burr ,  David Browning ,  Russell Aoki ,  Saara Kamppari

IPC分类号： G06F3/041 ,  G06F1/16

CPC分类号： G06F3/0416 ,  G06F1/1626 ,  G06F1/1641 ,  G06F1/1643 ,  G06F1/1652 ,  G06F1/1694 ,  G06F3/0412 ,  G06F3/04886 ,  G06F3/147 ,  G06F2203/04102 ,  G09G5/00 ,  G09G2340/0492 ,  G09G2354/00 ,  G09G2380/02

摘要： Particular embodiments described herein provide for an electronic device, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a main housing, a flexible display, and a touchscreen, wherein regions of the touchscreen can be reconfigured based on an orientation of the flexible display.

摘要翻译： 本文描述的特定实施例提供了一种电子设备，其包括耦合到多个电子部件（其包括任何类型的部件，元件，电路等）的电路板。 电子设备的一个具体示例实现可以包括主外壳，柔性显示器和触摸屏，其中触摸屏的区域可以基于柔性显示器的取向被重新配置。