公开(公告)号：US11291115B2

公开(公告)日：2022-03-29

申请号：US15942263

申请日：2018-03-30

申请人： Intel Corporation

发明人： Shelby A. Ferguson ,  Bijoyraj Sahu ,  Russell Aoki ,  Thomas Boyd ,  Eric W. Buddrius ,  Kevin Ceurter ,  Mustafa Haswarey ,  Rolf Laido ,  Daniel Neumann ,  Rachel Taylor ,  Anthony Valpiani

IPC分类号： H05K1/18 ,  H01L23/40 ,  H01L21/48 ,  H01R12/88 ,  H01R12/70 ,  H05K7/20 ,  H05K1/02

摘要： A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.