公开(公告)号：US10667438B2

公开(公告)日：2020-05-26

申请号：US13728174

申请日：2012-12-27

申请人： INTEL CORPORATION

发明人： Robin A. Steinbrecher ,  Nishi Ahuja ,  Sandeep Ahuja

IPC分类号： G06F11/30 ,  G21C17/00 ,  G01K1/08 ,  H05K7/20 ,  G05B23/02

摘要： A method for determining whether to perform maintenance for an electronic device includes generating a baseline characterization of thermal performance for a heat-generating component of the electronic device at a baseline date. The method also includes generating an assessment characterization of the thermal performance at an assessment date after the baseline date. The method further includes generating a historical trend that includes the baseline characterization and the assessment characterization. Additionally, the method includes determining whether to perform maintenance for the heat-generating component based on the historical trend and a specified maintenance parameter.

公开(公告)号：US20160179158A1

公开(公告)日：2016-06-23

申请号：US14852859

申请日：2015-09-14

申请人： Intel Corporation

发明人： Tessil Thomas ,  Robin A. Steinbrecher ,  Sandeep Ahuja ,  Michael Berktold ,  Timothy Y. Kam ,  Howard Chin ,  Phani Kumar Kandula ,  Krishnakanth V. Sistla

IPC分类号： G06F1/26 ,  G06F1/18 ,  G06F1/20 ,  G06F1/32

CPC分类号： G06F1/206 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F3/0412 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

摘要： In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

摘要翻译： 在一个实施例中，处理器包括至少一个核心和电源管理逻辑。 电源管理逻辑用于从包括处理器的封装内的多个管芯接收温度数据，并且确定多个温度控制裕度的最小温度控制裕度。 每个温度控制余量将基于与管芯相关联的相应的热控制温度并且还基于与管芯相关联的相应的温度数据来确定。 电源管理逻辑还可以生成包含最小温度控制余量的热报告，并存储热报告。 描述和要求保护其他实施例。

公开(公告)号：US09494996B2

公开(公告)日：2016-11-15

申请号：US13843855

申请日：2013-03-15

申请人： Intel Corporation

发明人： Ankush Varma ,  Robin A. Steinbrecher ,  Susan F. Smith ,  Sandeep Ahuja ,  Vivek Garg ,  Tessil Thomas ,  Krishnakanth V. Sistla ,  Chris Poirier ,  Martin Mark T. Rowland

IPC分类号： G06F1/32 ,  G06F1/00 ,  G06F1/20

CPC分类号： G06F1/3234 ,  G06F1/20 ,  G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3287 ,  Y02D10/126 ,  Y02D10/16

摘要： A processor is described having a semiconductor chip having non volatile storage circuitry. The non volatile storage circuitry has information identifying a maximum operational frequency of the processor at which the processor's operation is guaranteed for an ambient temperature that corresponds to an extreme thermal event.

摘要翻译： 描述了具有具有非易失性存储电路的半导体芯片的处理器。 非易失性存储电路具有识别处理器的最大工作频率的信息，在该处理器处理器的操作被保证对应于极端热事件的环境温度。

公开(公告)号：US20160174413A1

公开(公告)日：2016-06-16

申请号：US14571972

申请日：2014-12-16

申请人： Intel Corporation

发明人： Robin A. Steinbrecher

IPC分类号： H05K7/20

CPC分类号： H05K7/20727

摘要： Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device upon occurrence of a heat condition are disclosed herein. In embodiments, one or more piezo louvers, or some other cooling zone director, may be used to direct a fan from cooling a first one of the heat-generating components to cooling another one of the heat-generating components. Other embodiments may be described and/or claimed.

摘要翻译： 这里公开了在发生热条件时冷却电子设备的一个或多个发热部件的装置，方法和存储介质。 在实施例中，可以使用一个或多个压电百叶窗或一些其它冷却区导向器来引导风扇冷却第一个发热部件以冷却另一个发热部件。 可以描述和/或要求保护其他实施例。

公开(公告)号：US11543868B2

公开(公告)日：2023-01-03

申请号：US16898603

申请日：2020-06-11

申请人： Intel Corporation

发明人： Tessil Thomas ,  Robin A. Steinbrecher ,  Sandeep Ahuja ,  Michael Berktold ,  Timothy Y. Kam ,  Howard Chin ,  Phani Kumar Kandula ,  Krishnakanth V. Sistla

IPC分类号： G06F1/20 ,  G06F1/3296 ,  G06F1/3206 ,  G06F1/324 ,  G06F3/041 ,  G06F11/30 ,  G06F1/32 ,  G06F1/26

摘要： In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

公开(公告)号：US10168749B2

公开(公告)日：2019-01-01

申请号：US15366799

申请日：2016-12-01

申请人： Intel Corporation

发明人： Russell S. Aoki ,  Devdatta P. Kulkarni ,  Alan W. Tate ,  Robin A. Steinbrecher ,  Ralph W. Jensen

IPC分类号： H05K7/20 ,  G06F1/20 ,  F28F9/26 ,  H05K1/02 ,  H05K1/18 ,  H01L23/40 ,  H01L23/473

摘要： Embodiments described herein may include apparatus, system and/or processes to provide an adjustable thermal coupling between cold plate coupled to a first heat source and a liquid-cooled cold plate cooling a second heat source. In embodiments, the adjustable thermal coupling may provide a degree of freedom along an access in accommodating a dimension requirement of the second heat source. Other embodiments may be described and/or claimed.

公开(公告)号：US20180372551A1

公开(公告)日：2018-12-27

申请号：US15629625

申请日：2017-06-21

申请人： Intel Corporation

发明人： Janusz P. Jurski ,  Tozer J. Bandorawalla ,  Ramkumar Nagappan ,  Mariusz Oriol ,  Piotr Sawicki ,  Robin A. Steinbrecher ,  Shankar Krishnan

IPC分类号： G01K3/08 ,  F24F11/00

摘要： An apparatus is provided which comprises: a first circuitry to receive a measurement of a first temperature of a section of a computing device during a first loading condition of the computing device, and to receive a measurement of a second temperature of the section of the computing device during a second loading condition of the computing device; and a second circuitry to detect a potential fault in a cooling system to cool the computing device, based at least in part on the first temperature and the second temperature.

公开(公告)号：US20200301490A1

公开(公告)日：2020-09-24

申请号：US16898603

申请日：2020-06-11

申请人： Intel Corporation

发明人： Tessil Thomas ,  Robin A. Steinbrecher ,  Sandeep Ahuja ,  Michael Berktold ,  Timothy Y. Kam ,  Howard Chin ,  Phani Kumar Kandula ,  Krishnakanth V. Sistla

IPC分类号： G06F1/20 ,  G06F1/3296 ,  G06F1/3206 ,  G06F1/324 ,  G06F3/041

摘要： In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.

公开(公告)号：US20180066663A1

公开(公告)日：2018-03-08

申请号：US15260121

申请日：2016-09-08

申请人： Intel Corporation

发明人： Devdatta P. Kulkarni ,  Robin A. Steinbrecher

IPC分类号： F04D25/04 ,  H05K7/20

摘要： Processes, apparatuses, and systems are associated with using coolant-driven fans to cool computer systems. In embodiments, the flow of coolant through tubes used to cool cold plates within the system may be used to drive one or more fans within the system to provide additional airflow to cool components, for example, components to be air cooled that are attached to a motherboard. Other embodiments may be described and/or claimed.