公开(公告)号：US09754849B2

公开(公告)日：2017-09-05

申请号：US14581575

申请日：2014-12-23

申请人： INTEL CORPORATION

发明人： Plory Huang ,  Henry Su ,  Chee Key Chung ,  Ryan Ong ,  Jones Wang ,  Daniel Hsieh

IPC分类号： H01L23/02 ,  H01L23/13 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538 ,  H01L25/065 ,  H01L25/00 ,  H01L23/15

CPC分类号： H01L23/13 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49894 ,  H01L23/5384 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15311

摘要： An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes.

公开(公告)号：US20160181169A1

公开(公告)日：2016-06-23

申请号：US14581575

申请日：2014-12-23

申请人： INTEL CORPORATION

发明人： PLORY HUANG ,  Henry Su ,  Chee Key Chung ,  Ryan Ong ,  Jones Wang ,  Daniel Hsieh

IPC分类号： H01L23/13 ,  H01L23/00

CPC分类号： H01L23/13 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49894 ,  H01L23/5384 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/16235 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15311

摘要： An organic-inorganic hybrid structure is described for integrated circuit packages. In one example, an integrated circuit package includes a ceramic frame having a top side and a bottom side, the top side having a pocket with a bottom floor and a plurality of conductive through holes in the bottom floor, an integrated circuit die attached to the bottom floor over the conductive through holes, and a redistribution layer on the bottom side connected to the conductive through holes.

摘要翻译： 有机 - 无机混合结构描述用于集成电路封装。 在一个示例中，集成电路封装包括具有顶侧和底侧的陶瓷框架，顶侧具有底座底部的凹槽和底板中的多个导电通孔，附接到底板的集成电路芯片 底板上的导电通孔，以及底面上与导电通孔相连的再分布层。