公开(公告)号：US3830956A

公开(公告)日：1974-08-20

申请号：US34530273

申请日：1973-03-27

Applicant: INT COMPUTERS LTD

Inventor： WOOTTON D ,  OSBORNE C

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/116 ,  H05K1/0268 ,  H05K2203/162

Abstract: A construction of printed circuit board is disclosed in which conductive pads are arranged on the surface of a printed circuit board for contacting by probes of a test rig and which are connected to conductive tracks of the circuit board which otherwise may be inaccessible for test purposes.

Abstract translation: 公开了一种印刷电路板的结构，其中导电焊盘布置在印刷电路板的表面上，用于通过测试装置的探针接触，并且连接到电路板的导电轨道，否则可能无法进行测试。