Multilayer printed circuit board with test pads
    1.
    发明授权
    Multilayer printed circuit board with test pads 失效
    多层印刷电路板与测试垫

    公开(公告)号:US3830956A

    公开(公告)日:1974-08-20

    申请号:US34530273

    申请日:1973-03-27

    Inventor: WOOTTON D OSBORNE C

    CPC classification number: H05K1/116 H05K1/0268 H05K2203/162

    Abstract: A construction of printed circuit board is disclosed in which conductive pads are arranged on the surface of a printed circuit board for contacting by probes of a test rig and which are connected to conductive tracks of the circuit board which otherwise may be inaccessible for test purposes.

    Abstract translation: 公开了一种印刷电路板的结构,其中导电焊盘布置在印刷电路板的表面上,用于通过测试装置的探针接触,并且连接到电路板的导电轨道,否则可能无法进行测试。

    Electronic circuit installations
    2.
    发明授权
    Electronic circuit installations 失效
    电子电路安装

    公开(公告)号:US3792285A

    公开(公告)日:1974-02-12

    申请号:US3792285D

    申请日:1972-08-23

    CPC classification number: G01R1/04 Y10T307/461

    Abstract: The circuits of a multicircuit installation using common power feeders, are tested by being electrically isolated from the other circuits, individually activated and tested.

    Abstract translation: 使用公共电源馈线的多回路安装电路通过与其他电路进行电隔离测试,单独激活和测试。

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