公开(公告)号：US3795037A

公开(公告)日：1974-03-05

申请号：US3795037D

申请日：1972-12-11

Applicant: INT COMPUTERS LTD

Inventor： LUTTMER W

IPC: H01R13/64 ,  H01R43/00

CPC classification number: H01R12/714 ,  H01L2924/00013 ,  H01R13/64 ,  Y10T29/4922 ,  H01L2224/29099

Abstract: An electrical connector comprises a plurality of elongated flexible conductors embedded in, and extending between surface of, a block of elastomeric insulating material.

Abstract translation: 电连接器包括多个细长的柔性导体，其嵌入在弹性体绝缘材料块之间并在其表面之间延伸。

公开(公告)号：US3835531A

公开(公告)日：1974-09-17

申请号：US26334772

申请日：1972-06-08

Applicant: INT COMPUTERS LTD

Inventor： LUTTMER W

IPC: H05K1/02 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46 ,  H05K3/36

CPC classification number: H05K3/4614 ,  H05K1/0237 ,  H05K3/243 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2201/0305 ,  H05K2201/0367 ,  H05K2201/0715 ,  H05K2203/068 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K2203/1572 ,  Y10T29/49126 ,  Y10T29/49149

Abstract: A method of forming circuit interconnections between adjacent circuits of a multilayer circuit structure is described in which corresponding sets of solder protrusions carried on conductive tracks of adjacent circuits are separated by a layer of uncured, heat-curable insulating material having a transient state, in which the material becomes deformable, between the uncured and the cured states. The layer is heated and the circuits are urged towards one another during the transient, deformable state of the material so that the protrusions pierce the layer, corresponding protrusions contacting one another and the heat subsequently causing the material to become cured. Finally, the contacting protrusions are fused together.

Abstract translation: 描述了在多层电路结构的相邻电路之间形成电路互连的方法，其中在相邻电路的导电轨道上承载的相应组的焊料突起由具有瞬态的未固化，可热固化的绝缘材料层分开，其中 材料在未固化和固化状态之间变形。 该层被加热，并且在材料的瞬态可变形状态期间电路被推向彼此，使得突起刺穿该层，相应的突起彼此接触，随后导致材料变得固化。 最后，接触突起融合在一起。