公开(公告)号：US20190186969A1

公开(公告)日：2019-06-20

申请号：US15883619

申请日：2018-01-30

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shih-Yao Chen ,  Kuan-Wei Chen ,  Pei-Jer Tzeng ,  Wen Wang

IPC: G01F1/684

CPC classification number: G01F1/6847

Abstract: The disclosure provides a sensing device including a supporting member, a thermal resistance portion, a sensing unit and a heating unit. The supporting member has a supporting surface. The thermal resistance portion is located within the supporting member, wherein a thermal conductivity of the thermal resistance portion is less than a thermal conductivity of the supporting member. The sensing unit is disposed on the supporting surface. The heating unit is disposed on the supporting surface, wherein the heating unit is configured to heat the sensing unit, and an orthogonal projection of the heating unit on the supporting surface overlaps an orthogonal projection of the thermal resistance portion on the supporting surface. In addition, the disclosure also provides a method for manufacturing the sensing device.