公开(公告)号：US08830458B2

公开(公告)日：2014-09-09

申请号：US13752307

申请日：2013-01-28

Applicant: Industrial Technology Research Institute

Inventor： Deh-Ming Shyu ,  Yi-Sha Ku

IPC: G01N21/00 ,  G01B11/24

CPC classification number: G01B11/24 ,  G01B11/12 ,  G01B11/22

Abstract: A measurement system is provided to measure a hole of a target, including a light source generation unit, a capturing unit and a processing unit. The light source generation unit generates a light source and focuses the light source on a plurality of different height planes. The capturing unit captures a plurality of images scattered from the plurality of different height planes. The processing unit obtains boundaries of the hole on the plurality of different height planes according to the plurality of images, samples image intensities of different azimuth angles on the boundaries of the hole on each of the plurality of different height planes to generate a plurality of sampling values, and develops a sidewall image of the hole according to the plurality of sampling values, the plurality of different height planes and the different azimuth angles.

Abstract translation: 提供测量系统来测量目标的孔，包括光源产生单元，捕获单元和处理单元。 光源生成单元生成光源并将光源聚焦在多个不同的高度平面上。 捕获单元捕获从多个不同高度平面散射的多个图像。 处理单元根据多个图像获得多个不同高度平面上的孔的边界，在多个不同高度平面中的每一个的孔的边界上采样不同方位角的图像强度，以产生多个采样 值，并且根据多个采样值，多个不同的高度平面和不同的方位角度来形成孔的侧壁图像。

公开(公告)号：US09182681B2

公开(公告)日：2015-11-10

申请号：US13726409

申请日：2012-12-24

Applicant: Industrial Technology Research Institute

Inventor： Deh-Ming Shyu ,  Yi-Sha Ku

IPC: G01B9/02 ,  G03F7/20

CPC classification number: G03F7/70633

Abstract: According to one embodiment of a method for measuring a stacking overlay error, the method may use a differential interference contrast microscope system to measure a stacking overlay mark and focus on one overlay mark of a lower layer overlay mark and an upper layer overlay mark when measuring the stacking overlay mark. Then, the method uses an image analysis scheme to obtain an image of the stacking overlay mark from a photo-detector and obtains a first reference position of the lower layer overlay mark in a direction and a second reference position of the upper layer overlay mark in the direction from the image; and computes the stacking overlay error in the direction according to the first and the second reference positions.

Abstract translation: 根据用于测量堆叠重叠误差的方法的一个实施例，该方法可以使用微分干涉对比度显微镜系统来测量堆叠叠加标记并且在测量时聚焦在下层覆盖标记和上层覆盖标记的一个覆盖标记上 堆叠叠加标记。 然后，该方法使用图像分析方案从光电检测器获得堆叠叠加标记的图像，并且在上层叠加标记的方向和第二参考位置上获得下层重叠标记的第一参考位置 从图像的方向; 并根据第一和第二参考位置计算方向上的堆叠叠加误差。

公开(公告)号：US20140085640A1

公开(公告)日：2014-03-27

申请号：US13752307

申请日：2013-01-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Deh-Ming Shyu ,  Yi-Sha Ku

IPC: G01B11/24

CPC classification number: G01B11/24 ,  G01B11/12 ,  G01B11/22

Abstract: A measurement system is provided to measure a hole of a target, including a light source generation unit, a capturing unit and a processing unit. The light source generation unit generates a light source and focuses the light source on a plurality of different height planes. The capturing unit captures a plurality of images scattered from the plurality of different height planes. The processing unit obtains boundaries of the hole on the plurality of different height planes according to the plurality of images, samples image intensities of different azimuth angles on the boundaries of the hole on each of the plurality of different height planes to generate a plurality of sampling values, and develops a sidewall image of the hole according to the plurality of sampling values, the plurality of different height planes and the different azimuth angles.

Abstract translation: 提供测量系统来测量目标的孔，包括光源产生单元，捕获单元和处理单元。 光源生成单元生成光源并将光源聚焦在多个不同的高度平面上。 捕获单元捕获从多个不同高度平面散射的多个图像。 处理单元根据多个图像获得多个不同高度平面上的孔的边界，在多个不同高度平面中的每一个的孔的边界上采样不同方位角的图像强度，以产生多个采样 值，并且根据多个采样值，多个不同的高度平面和不同的方位角度来形成孔的侧壁图像。

公开(公告)号：US20140118721A1

公开(公告)日：2014-05-01

申请号：US13726409

申请日：2012-12-24

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Deh-Ming Shyu ,  Yi-Sha Ku

IPC: G03F9/00

CPC classification number: G03F7/70633

Abstract: According to one embodiment of a method for measuring a stacking overlay error, the method may use a differential interference contrast microscope system to measure a stacking overlay mark and focus on one overlay mark of a lower layer overlay mark and an upper layer overlay mark when measuring the stacking overlay mark. Then, the method uses an image analysis scheme to obtain an image of the stacking overlay mark from a photo-detector and obtains a first reference position of the lower layer overlay mark in a direction and a second reference position of the upper layer overlay mark in the direction from the image; and computes the stacking overlay error in the direction according to the first and the second reference positions.

Abstract translation: 根据用于测量堆叠重叠误差的方法的一个实施例，该方法可以使用微分干涉对比度显微镜系统来测量堆叠叠加标记并且在测量时聚焦在下层覆盖标记和上层覆盖标记的一个覆盖标记上 堆叠叠加标记。 然后，该方法使用图像分析方案从光电检测器获得堆叠叠加标记的图像，并且在上层叠加标记的方向和第二参考位置上获得下层重叠标记的第一参考位置 从图像的方向; 并根据第一和第二参考位置计算方向上的堆叠叠加误差。