公开(公告)号：US09276556B1

公开(公告)日：2016-03-01

申请号：US14032871

申请日：2013-09-20

申请人： I-Tsang Wu ,  Julio Mario Dewdney ,  Jing Wang

发明人： I-Tsang Wu ,  Julio Mario Dewdney ,  Jing Wang

IPC分类号： H03H9/54 ,  H03H9/46 ,  H03H9/205 ,  H03H9/50 ,  H03H9/15

CPC分类号： H03H9/462 ,  H03H9/2436 ,  H03H9/505 ,  H03H2009/155

摘要： In some embodiments, a micromechanical filter includes multiple subfilters, each subfilter comprising multiple piezoelectric resonators mechanically coupled in series, wherein the subfilters are mechanically coupled to each other in parallel.

摘要翻译： 在一些实施例中，微机械滤波器包括多个子滤波器，每个子滤波器包括串联机械耦合的多个压电谐振器，其中子滤波器彼此机械耦合。

公开(公告)号：US09160305B1

公开(公告)日：2015-10-13

申请号：US14050860

申请日：2013-10-10

申请人： I-Tsang Wu ,  Julio Mario Dewdney ,  Jing Wang

发明人： I-Tsang Wu ,  Julio Mario Dewdney ,  Jing Wang

IPC分类号： H03H9/50 ,  H03H9/54 ,  H03H3/04

CPC分类号： H03H3/02 ,  H03H9/171 ,  H03H9/2405 ,  H03H2003/027 ,  H03H2009/02496

摘要： In one embodiment, a hybrid micromechanical resonator includes a capacitive resonator element and a piezoelectric resonator element, wherein the resonator can be capacitively and piezoelectrically transduced.

摘要翻译： 在一个实施例中，混合微机械谐振器包括电容性谐振器元件和压电谐振器元件，其中谐振器可以电容和压电转换。

公开(公告)号：US10158340B1

公开(公告)日：2018-12-18

申请号：US15010038

申请日：2016-01-29

申请人： I-Tsang Wu ,  Julio Mario Dewdney ,  Jing Wang

发明人： I-Tsang Wu ,  Julio Mario Dewdney ,  Jing Wang

IPC分类号： H03H9/24 ,  H03H9/02 ,  H01L41/047 ,  H03H9/46 ,  H03H9/19

摘要： A piezoelectrically transduced resonator device includes a wafer having a substrate, a buried oxide layer formed on the substrate, and a device layer formed on the buried oxide layer, and a resonator suspended within an air gap of the wafer above the substrate, the resonator including a portion of the device layer, a piezoelectric layer, and top and bottom electrodes contacting top and bottom sides of the piezoelectric layer, wherein the portion of the device layer is not directly connected to the wafer and wherein the resonator is configured to move relative to the substrate under electrostatic force to tune the frequency of the resonator device when a direct current voltage is applied between the substrate and the portion of the device layer of the resonator.