公开(公告)号：US20120305293A1

公开(公告)日：2012-12-06

申请号：US13283824

申请日：2011-10-28

Applicant: Hyun-seok Kim ,  Inh-seok Suh ,  Tak-kyoum Kim

Inventor： Hyun-seok Kim ,  Inh-seok Suh ,  Tak-kyoum Kim

IPC: H05K1/00 ,  H05K3/36 ,  H05K1/11

CPC classification number: H05K3/3452 ,  H05K3/363 ,  H05K2201/09063

Abstract: According to an aspect of the invention, there is provided a circuit board assembly including a first circuit board including a first circuit pattern formed on a surface of the first circuit board, and an opening that is adjacent to the first circuit pattern; and a second circuit board including a second circuit pattern corresponding to the first circuit pattern and a protection film that is applied to a surface of the second circuit board so as to form a hollow place located corresponding to the opening, wherein the first circuit board and the second circuit board are combined with each other.

Abstract translation: 根据本发明的一个方面，提供了一种电路板组件，包括：第一电路板，包括形成在第一电路板的表面上的第一电路图案和与第一电路图案相邻的开口; 以及第二电路板，包括对应于第一电路图案的第二电路图案和保护膜，该保护膜施加到第二电路板的表面，以形成对应于开口的中空位置，其中第一电路板和 第二电路板彼此组合。

公开(公告)号：US08835774B2

公开(公告)日：2014-09-16

申请号：US13283824

申请日：2011-10-28

Applicant: Hyun-seok Kim ,  Inh-seok Suh ,  Tak-kyoum Kim

Inventor： Hyun-seok Kim ,  Inh-seok Suh ,  Tak-kyoum Kim

IPC: H05K1/16 ,  H05K1/11

CPC classification number: H05K3/3452 ,  H05K3/363 ,  H05K2201/09063

Abstract: According to an aspect of the invention, there is provided a circuit board assembly including a first circuit board including a first circuit pattern formed on a surface of the first circuit board, and an opening that is adjacent to the first circuit pattern; and a second circuit board including a second circuit pattern corresponding to the first circuit pattern and a protection film that is applied to a surface of the second circuit board so as to form a hollow place located corresponding to the opening, wherein the first circuit board and the second circuit board are combined with each other.

Abstract translation: 根据本发明的一个方面，提供了一种电路板组件，包括：第一电路板，包括形成在第一电路板的表面上的第一电路图案和与第一电路图案相邻的开口; 以及第二电路板，包括对应于第一电路图案的第二电路图案和保护膜，该保护膜施加到第二电路板的表面，以形成对应于开口的中空位置，其中第一电路板和 第二电路板彼此组合。

公开(公告)号：US20110085054A1

公开(公告)日：2011-04-14

申请号：US12902199

申请日：2010-10-12

Applicant: Jong-kwan Choi ,  Tak-kyoum Kim

Inventor： Jong-kwan Choi ,  Tak-kyoum Kim

IPC: H04N5/76 ,  H04N5/225 ,  G06F3/048

CPC classification number: G06F1/3203 ,  H04N5/63 ,  H04N5/772 ,  H04N21/42202 ,  H04N21/4223

Abstract: An apparatus and method for reducing power consumption in a digital image processor are disclosed. The apparatus includes a global positioning system (GPS) module using power and configured to generate initial GPS location information of the digital image processor; and a digital signal processor (DSP) configured to receive the initial GPS location information, to set user selected location information for recording in a captured image, and to cut the power to the GPS module. The method includes supplying power to a global positioning system (GPS) module; receiving initial GPS location information of the digital image processor, wherein the initial GPS location is generated by the GPS module; setting a user selected location information to capture an image; and cutting the power to the GPS module.

Abstract translation: 公开了一种用于降低数字图像处理器中的功耗的装置和方法。 该装置包括使用电力并被配置为产生数字图像处理器的初始GPS位置信息的全球定位系统（GPS）模块; 以及被配置为接收初始GPS位置信息的数字信号处理器（DSP），以设置用户所选择的位置信息以在拍摄图像中进行记录，并且切断对GPS模块的电力。 该方法包括向全球定位系统（GPS）模块供电; 接收数字图像处理器的初始GPS位置信息，其中初始GPS位置由GPS模块产生; 设置用户选择的位置信息以捕获图像; 并切断GPS模块的电源。