公开(公告)号：US06379744B1

公开(公告)日：2002-04-30

申请号：US08590042

申请日：1996-02-05

申请人： Hussain Gouranlou ,  Wayne Fowler

发明人： Hussain Gouranlou ,  Wayne Fowler

IPC分类号： B05D512

CPC分类号： B05D1/005 ,  B05D7/542 ,  G03F7/162

摘要： An integrated circuit substrate (10) is uniformly coated with a defect free layer of material (18), while minimizing the volume of material (18) dispensed on to the integrated circuit substrate (10). In one embodiment a first predetermined quantity of material (18) is dispensed on to the integrated circuit substrate (10) while the integrated circuit substrate (10) is not spinning. After the first predetermined quantity of material (18) is dispensed the integrated circuit substrate (10) is radially accelerated to a first predetermined spin speed. A second predetermined quantity of the material (18) is then dispensed on to the first predetermined quantity of material (18), while the integrated circuit substrate (10) is spinning. After the second predetermined quantity of material (18) is dispensed the integrated circuit substrate (10) is radially accelerated to a second predetermined spin speed.

摘要翻译： 集成电路基板（10）被均匀地涂覆有无缺陷材料层（18），同时最小化分配到集成电路基板（10）上的材料（18）的体积。 在一个实施例中，当集成电路基板（10）不旋转时，第一预定量的材料（18）被分配到集成电路基板（10）上。 在分配第一预定量的材料（18）之后，集成电路基板（10）径向加速到第一预定旋转速度。 然后，当集成电路基板（10）旋转时，第二预定量的材料（18）被分配到第一预定量的材料（18）上。 在第二预定量的材料（18）被分配之后，集成电路衬底（10）被径向加速到第二预定旋转速度。