An integrated circuit substrate (10) is uniformly coated with a defect free layer of material (18), while minimizing the volume of material (18) dispensed on to the integrated circuit substrate (10). In one embodiment a first predetermined quantity of material (18) is dispensed on to the integrated circuit substrate (10) while the integrated circuit substrate (10) is not spinning. After the first predetermined quantity of material (18) is dispensed the integrated circuit substrate (10) is radially accelerated to a first predetermined spin speed. A second predetermined quantity of the material (18) is then dispensed on to the first predetermined quantity of material (18), while the integrated circuit substrate (10) is spinning. After the second predetermined quantity of material (18) is dispensed the integrated circuit substrate (10) is radially accelerated to a second predetermined spin speed.