公开(公告)号：US09968001B2

公开(公告)日：2018-05-08

申请号：US15356103

申请日：2016-11-18

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xingxing Huang ,  Kaikai Liu ,  Shineng Chen

IPC: H05K7/20 ,  F25B21/02 ,  G02B6/42 ,  H05K5/00

CPC classification number: H05K7/20263 ,  F25B21/02 ,  F25B2321/023 ,  F25B2321/0251 ,  F25B2321/0252 ,  G02B6/42 ,  G02B6/4266 ,  G02B6/4268 ,  G02B6/4271 ,  H05K5/0026 ,  H05K7/20281 ,  H05K7/20336 ,  H05K7/20445 ,  H05K7/2049

Abstract: Embodiments of the present invention disclose a heat dissipation assembly including: a cage, a TEC assembly, a mounting kit, an elastic carrier, and a heat pipe, where a window is provided in a side face of the cage, the TEC assembly is located on an outer side of the cage, and a cold side of the TEC assembly passes through the window and thermally communicates with the heat emitting device in the cage; the mounting kit is configured to mount the TEC assembly and enable the TEC assembly to move in a direction leaving or approaching the heat emitting device; and a heat absorption portion of the heat pipe is mounted on the elastic carrier, and the heat absorption portion that is of the heat pipe and that is mounted on the elastic carrier thermally communicates with a hot side of the TEC assembly.