Invention Grant
- Patent Title: Heat dissipation assembly and communications device
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Application No.: US15356103Application Date: 2016-11-18
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Publication No.: US09968001B2Publication Date: 2018-05-08
- Inventor: Xingxing Huang , Kaikai Liu , Shineng Chen
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: CN201510808794 20151120
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F25B21/02 ; G02B6/42 ; H05K5/00

Abstract:
Embodiments of the present invention disclose a heat dissipation assembly including: a cage, a TEC assembly, a mounting kit, an elastic carrier, and a heat pipe, where a window is provided in a side face of the cage, the TEC assembly is located on an outer side of the cage, and a cold side of the TEC assembly passes through the window and thermally communicates with the heat emitting device in the cage; the mounting kit is configured to mount the TEC assembly and enable the TEC assembly to move in a direction leaving or approaching the heat emitting device; and a heat absorption portion of the heat pipe is mounted on the elastic carrier, and the heat absorption portion that is of the heat pipe and that is mounted on the elastic carrier thermally communicates with a hot side of the TEC assembly.
Public/Granted literature
- US20170150645A1 HEAT DISSIPATION ASSEMBLY AND COMMUNICATIONS DEVICE Public/Granted day:2017-05-25
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