公开(公告)号：US20060043318A1

公开(公告)日：2006-03-02

申请号：US11210394

申请日：2005-08-24

申请人： Hideki Kodera

发明人： Hideki Kodera

IPC分类号： G01J3/10

CPC分类号： G02F1/1339 ,  G02F2001/13415

摘要： A UV-ray-curing device includes a stage for mounting thereon an LC panel having UV-ray-heat curable resin between a TFT substrate and a color-filter substrate for encircling an LC layer, a light source for irradiating the UV-heat-curable resin with UV-rays through a mask having a mask pattern to cure the resin, an elevating device for moving the mask toward the stage to cool the mask after removing the LC panel, and irradiating UV-heat-curable resin in another display panel with UV-rays to cure the resin.

摘要翻译： 紫外线固化装置包括：在TFT基板和用于环绕LC层的滤色器基板之间安装有具有UV射线热固化树脂的LC面板的台，用于照射UV- 通过具有掩模图案的掩模的紫外线固化树脂固化树脂;升降装置，用于在除去LC面板之后将掩模移动到台阶以冷却掩模;以及在另一个显示面板中照射UV-热固化树脂 用紫外线固化树脂。

公开(公告)号：US08767138B2

公开(公告)日：2014-07-01

申请号：US12675858

申请日：2008-08-20

申请人： Hideki Kodera

发明人： Hideki Kodera

IPC分类号： G02F1/1333

CPC分类号： B65H37/04 ,  B32B37/003 ,  B32B38/1858 ,  B32B2315/08 ,  B32B2457/202 ,  B65C9/26 ,  B65H2406/351 ,  B65H2406/36 ,  B65H2701/1752 ,  B65H2801/61 ,  G02F1/1303

摘要： A vacuum suction control mechanism apparatus is capable of accurately bonding a film to a bonding object with a simple structure. The vacuum suction control mechanism apparatus includes a bonding head including a space defined therein, suction holes attracting a film, the suction holes extending from a surface of the bonding head to the space defined in the bonding head, a movable piece partitioning the space into two regions, the movable piece being movable relative to the bonding head within the space in contact with the suction holes, and a connection portion connectable to a decompression source, the connection portion being provided in a first region of the two regions.

摘要翻译： 真空吸引控制机构装置能够以简单的结构将膜精确地接合到接合体上。 真空抽吸控制机构装置包括：接合头，其包括限定在其中的空间，吸引薄膜的吸孔，吸附孔从接合头的表面延伸到接合头中限定的空间;将空间分成两部分的可动件 区域，所述可动片相对于与所述吸孔接触的空间内的所述接合头可移动，以及可连接到减压源的连接部，所述连接部设置在所述两个区域的第一区域中。

公开(公告)号：US08887781B2

公开(公告)日：2014-11-18

申请号：US12675575

申请日：2008-08-20

申请人： Hideki Kodera

发明人： Hideki Kodera

IPC分类号： B65C9/00 ,  B65H37/04 ,  B29C63/02 ,  B32B38/18 ,  B32B37/00 ,  G02F1/13 ,  G02F1/1335

CPC分类号： B32B38/1858 ,  B29C63/024 ,  B32B37/0053 ,  B32B2457/20 ,  B65H37/04 ,  B65H2406/3314 ,  B65H2406/361 ,  B65H2406/3612 ,  B65H2701/1752 ,  B65H2801/61 ,  G02F1/1303 ,  G02F1/133528 ,  Y10T156/10 ,  Y10T156/1033 ,  Y10T156/1062 ,  Y10T156/1744 ,  Y10T156/1773

摘要： An object of the present invention is to provide a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure. A vacuum suction control mechanism apparatus according to the present invention includes a first member including a plurality of suction holes formed in a surface thereof, the plurality of suction holes being connectable to a decompression source, and a second member capable of contacting the plurality of suction holes, the second member being movable relative to the first member, wherein the second member includes connecting member connecting some of the suction holes, the number of which corresponds to a relative position between the first member and the second member, to the decompression source.

摘要翻译： 本发明的目的是提供一种能够以简单的结构将膜精确地粘接到接合体上的真空吸引控制机构装置。 根据本发明的真空抽吸控制机构装置包括：第一构件，其包括形成在其表面中的多个抽吸孔，所述多个抽吸孔可连接到减压源;以及第二构件，其能够接触所述多个抽吸 所述第二构件可相对于所述第一构件移动，其中所述第二构件包括将所述第一构件和所述第二构件之间的相对位置的数量对应于所述减压源的连接构件。

公开(公告)号：US20100214504A1

公开(公告)日：2010-08-26

申请号：US12675858

申请日：2008-08-20

申请人： Hideki Kodera

发明人： Hideki Kodera

IPC分类号： G02F1/1335 ,  B32B37/00

CPC分类号： B65H37/04 ,  B32B37/003 ,  B32B38/1858 ,  B32B2315/08 ,  B32B2457/202 ,  B65C9/26 ,  B65H2406/351 ,  B65H2406/36 ,  B65H2701/1752 ,  B65H2801/61 ,  G02F1/1303

摘要： An object of the present invention is to provide a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure. A vacuum suction control mechanism apparatus according to the present invention includes a bonding head including a space defined therein, a plurality of suction holes attracting a film, the plurality of suction holes extending from a surface of the bonding head to the space defined in the bonding head, a movable piece partitioning the space into two regions, the movable piece being movable relative to the bonding head within the space in contact with the suction holes, and a connection portion connectable to a decompression source, the connection portion being provided in a first region of the two regions.

摘要翻译： 本发明的目的是提供一种能够以简单的结构将膜精确地粘接到接合体上的真空吸引控制机构装置。 根据本发明的真空吸引控制机构装置包括：接合头，其包括限定在其中的空间;多个吸引膜的吸引孔;多个吸附孔，从接合头的表面延伸到在接合 头部，将空间分成两个区域的可动件，可动件可在与吸孔接触的空间内相对于接合头移动，以及可连接到减压源的连接部分，连接部分设置在第一 两地区域。

公开(公告)号：US20100206485A1

公开(公告)日：2010-08-19

申请号：US12675575

申请日：2008-08-20

申请人： Hideki Kodera

发明人： Hideki Kodera

IPC分类号： B29C63/20

CPC分类号： B32B38/1858 ,  B29C63/024 ,  B32B37/0053 ,  B32B2457/20 ,  B65H37/04 ,  B65H2406/3314 ,  B65H2406/361 ,  B65H2406/3612 ,  B65H2701/1752 ,  B65H2801/61 ,  G02F1/1303 ,  G02F1/133528 ,  Y10T156/10 ,  Y10T156/1033 ,  Y10T156/1062 ,  Y10T156/1744 ,  Y10T156/1773

摘要： An object of the present invention is to provide a vacuum suction control mechanism apparatus capable of accurately bonding a film to a bonding object with a simple structure. A vacuum suction control mechanism apparatus according to the present invention includes a first member including a plurality of suction holes formed in a surface thereof, the plurality of suction holes being connectable to a decompression source, and a second member capable of contacting the plurality of suction holes, the second member being movable relative to the first member, wherein the second member includes connecting member connecting some of the suction holes, the number of which corresponds to a relative position between the first member and the second member, to the decompression source.

摘要翻译： 本发明的目的是提供一种能够以简单的结构将膜精确地粘接到接合体上的真空吸引控制机构装置。 根据本发明的真空抽吸控制机构装置包括：第一构件，其包括形成在其表面中的多个抽吸孔，所述多个抽吸孔可连接到减压源;以及第二构件，其能够接触所述多个抽吸 所述第二构件可相对于所述第一构件移动，其中所述第二构件包括将所述第一构件和所述第二构件之间的相对位置的数量对应于所述减压源的连接构件。