公开(公告)号：US12130280B2

公开(公告)日：2024-10-29

申请号：US17865253

申请日：2022-07-14

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： John Rossi ,  Scott A. Linn ,  James Michael Gardner ,  Erik D. Ness

IPC: B41J2/045 ,  A61K47/18 ,  A61K47/26 ,  G01N27/327 ,  G01N33/49 ,  G01N33/66 ,  G06F3/12 ,  B41J2/175

CPC classification number: G01N33/4925 ,  A61K47/18 ,  A61K47/26 ,  B41J2/04543 ,  G01N27/3274 ,  G01N33/66 ,  G06F3/1206 ,  B41J2/04586 ,  B41J2/175 ,  G01N2496/70

Abstract: A fluid ejection controller interface includes input logic to receive control data packets and a first clock signal, each control data packet including a set of primitive data bits and a set of random bits, wherein the input logic identifies the random bits in the received control data packets to facilitate the creation of modified control data packets. The fluid ejection controller interface includes a clock signal generator to generate a second clock signal that is different than the first clock signal, and output logic to receive the modified control data packets, and output the modified control data packets to a fluid ejection controller of a fluid ejection device based on the second clock signal.

公开(公告)号：US12115790B2

公开(公告)日：2024-10-15

申请号：US17419606

申请日：2019-05-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Michael Gardner ,  Scott A. Linn ,  John Rossi

IPC: B41J2/165 ,  B41J2/045 ,  G01L1/18 ,  G01L1/26

CPC classification number: B41J2/16517 ,  B41J2/0451 ,  B41J2/04513 ,  B41J2/04563 ,  B41J2/16535 ,  G01L1/18 ,  G01L1/26

Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes a strain gauge sensor, an amplifier, and a voltage bias generator. The strain gauge sensor generates a strain gauge signal. The amplifier amplifies the strain gauge signal. The voltage bias generator offsets the amplified strain gauge signal.

公开(公告)号：US20240286401A1

公开(公告)日：2024-08-29

申请号：US18571690

申请日：2021-07-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： James Michael Gardner ,  Scott A. Linn

IPC: B41J2/045 ,  G11C5/14

CPC classification number: B41J2/04541 ,  B41J2/04586 ,  G11C5/147

Abstract: A print cartridge circuitry component comprising an integrated circuit for association with a plurality of fluid actuation devices and comprising input signal contacts to receive input signals from a host printer. The integrated circuit includes a plurality of memory cells, a first power supply node, and a second power supply node. The first power supply node is to supply power to the plurality of memory cells to write data to the plurality of memory cells. The second power supply node is to supply power to the plurality of memory cells to read data from the plurality of memory cells.

公开(公告)号：US11726146B2

公开(公告)日：2023-08-15

申请号：US17251951

申请日：2019-02-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： John Michael Rossi ,  Erik Donald Ness ,  Scott Alan Linn ,  James Michael Gardner

IPC: B41J2/175 ,  G01R31/68 ,  G01R31/28

CPC classification number: G01R31/68 ,  B41J2/17546 ,  G01R31/2853

Abstract: Examples of an electronic device are described. In some examples, the electronic device includes a first shared line of a plurality of first contacts to respectively connect to a plurality of integrated circuits, a plurality of second lines of respective second contacts to respectively connect to the plurality of integrated circuits, and a third shared line of a plurality of third contacts to respectively connect to the plurality of integrated circuits. In some examples, the electronic device includes circuitry to determine whether one of the third contacts is connected to an integrated circuit based on a state of the first shared line and a state of one of the second lines that is associated with the one of the third contacts.

公开(公告)号：US11667116B2

公开(公告)日：2023-06-06

申请号：US17859188

申请日：2022-07-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Scott A. Linn ,  James Michael Gardner ,  John Rossi

IPC: B41J2/045 ,  B41J2/14

CPC classification number: B41J2/0458 ,  B41J2/04585 ,  B41J2002/14475

Abstract: A print component includes an array of fluidic actuation structures including a first column of fluidic actuating structures addressable by a set of actuation addresses, each fluidic actuating structure having a different one of the actuation addresses and having a fluidic architecture type, and a second column of fluidic actuating structures addressable by the set of actuation addresses. Each fluidic actuating structure of the second column has a different one of the actuation addresses and has a same fluidic architecture type as the fluidic actuating structure of the first column having the same address. An address bus communicates the set of addresses to the array of fluidic actuating structures, and a fire signal line communicates a plurality of fire pulse signal types to the array of fluidic actuating structures, the fire pulse signal type depending on the actuation address on the address bus.

公开(公告)号：US11642884B2

公开(公告)日：2023-05-09

申请号：US16766525

申请日：2019-02-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Scott A. Linn ,  Anthony M. Fuller ,  James Michael Gardner

IPC: B41J2/14

CPC classification number: B41J2/14072 ,  B41J2/14056 ,  B41J2002/14491 ,  B41J2202/13

Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. The die includes a number of fluidic actuators, proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Circuitry on the die operates the fluidic actuators, wherein traces are provided in layers between adjacent fluid feed holes, connecting circuitry on each side of the fluid feed holes.

公开(公告)号：US11625493B2

公开(公告)日：2023-04-11

申请号：US17569273

申请日：2022-01-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： James Michael Gardner ,  Scott A. Linn ,  Stephen D. Panshin ,  Jefferson P. Ward ,  David Owen Roethig

IPC: G06F21/60 ,  G06F13/42 ,  B41J2/175 ,  G06F21/44

Abstract: In an example, a method comprises, by logic circuitry associated with a replaceable print apparatus component, responding to a first validation request sent via an I2C bus to a first address associated with the logic circuitry with a first validation response; and responding to a second validation request sent via the I2C bus to a second address associated with the logic circuitry with a second validation response.

公开(公告)号：US11590752B2

公开(公告)日：2023-02-28

申请号：US16768588

申请日：2019-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Michael Gardner ,  Boon Bing Ng

IPC: B41J2/045 ,  G06F3/12 ,  G06F13/16 ,  G11C7/10 ,  G11C16/10 ,  G11C16/26

Abstract: A memory circuit for a print component including plurality of I/O pads, including a first analog pad and a second analog pad, to connect to a plurality of signal paths which communicate operating signals to the print component, including an analog signal path connected to the first analog pad and the second analog pad, the first analog pad electrically isolated from the second analog pad to interrupt the analog signal path to the print component. The memory circuit further includes a memory component to store memory values associated with the print component, and a control circuit to, in response to a sequence of operating signals received by the I/O pads representing a memory read, provide an analog signal to the analog pad to provide an analog electrical value at the analog pad representing stored memory values selected by the memory read.

公开(公告)号：US20230018474A1

公开(公告)日：2023-01-19

申请号：US17951929

申请日：2022-09-23

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  James Michael Gardner ,  Scott A. Linn ,  George H. Corrigan, III

IPC: B41J2/045 ,  G01K13/02

Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.

公开(公告)号：US20220388301A1

公开(公告)日：2022-12-08

申请号：US17775350

申请日：2019-11-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Daryl Eugene Anderson ,  James Michael Gardner

IPC: B41J2/045

Abstract: In some examples, a controller to receives, from a strain sensor in a fluidic die component, measured strain data, and detects a change in direction of the fluidic die component based on the measured strain data.