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公开(公告)号：US09330987B2
公开(公告)日：2016-05-03
申请号：US14481247
申请日：2014-09-09
Applicant: Hermes-Microvision, Inc.
Inventor： Steve Lin , Wei Fang , Eric Ma , Zhonghua Dong , Jon Chiang , Yan Zhao , Chester Kuo , Zhongwei Chen
CPC classification number: H01L22/12 , G03F1/86 , G03F7/7065 , H01J2237/103 , H01J2237/221 , H01J2237/2817
Abstract: A method for identifying, inspecting, and reviewing all hot spots on a specimen is disclosed by using at least one SORIL e-beam tool. A full die on a semiconductor wafer is scanned by using a first identification recipe to obtain a full die image of that die and then design layout data is aligned and compared with the full die image to identify hot spots on the full die. Threshold levels used to identify hot spots can be varied and depend on the background environments close thereto, materials of the specimens, defect types, and design layout data. A second recipe is used to selectively inspect locations of all hot spots to identify killers, and then killers can be reviewed with a third recipe.
Abstract translation: 通过使用至少一个SORIL电子束工具来公开用于识别，检查和检查试样上的所有热点的方法。 通过使用第一识别配方扫描半导体晶片上的全裸片以获得该裸片的完整裸片图像，然后将设计布局数据对准并与全裸片图像进行比较，以识别全裸片上的热点。 用于识别热点的阈值水平可以变化并且取决于靠近的背景环境，样本的材料，缺陷类型和设计布局数据。 使用第二个方法来选择性地检查所有热点的位置以识别杀手，然后用第三个配方来检查杀手。
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公开(公告)号：US20150069232A1
公开(公告)日：2015-03-12
申请号：US14481247
申请日：2014-09-09
Applicant: Hermes-Microvision, Inc.
Inventor： Steve Lin , Wei Fang , Eric Ma , Zhonghua Dong , Jon Chiang , Yan Zhao , Chester Kuo , Zhongwei Chen
CPC classification number: H01L22/12 , G03F1/86 , G03F7/7065 , H01J2237/103 , H01J2237/221 , H01J2237/2817
Abstract: A method for identifying, inspecting, and reviewing all hot spots on a specimen is disclosed by using at least one SORIL e-beam tool. A full die on a semiconductor wafer is scanned by using a first identification recipe to obtain a full die image of that die and then design layout data is aligned and compared with the full die image to identify hot spots on the full die. Threshold levels used to identify hot spots can be varied and depend on the background environments close thereto, materials of the specimens, defect types, and design layout data. A second recipe is used to selectively inspect locations of all hot spots to identify killers, and then killers can be reviewed with a third recipe.
Abstract translation: 通过使用至少一个SORIL电子束工具来公开用于识别，检查和检查试样上的所有热点的方法。 通过使用第一识别配方扫描半导体晶片上的全裸片以获得该裸片的完整裸片图像，然后将设计布局数据对准并与全裸片图像进行比较，以识别全裸片上的热点。 用于识别热点的阈值水平可以变化并且取决于靠近的背景环境，样本的材料，缺陷类型和设计布局数据。 使用第二个方法来选择性地检查所有热点的位置以识别杀手，然后用第三个配方来检查杀手。
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