公开(公告)号：US20220002559A1

公开(公告)日：2022-01-06

申请号：US17448404

申请日：2021-09-22

申请人： Henkel AG & Co. KGaA

发明人： John L. Zimmerman ,  John D. McGee ,  Gregory T. Donaldson ,  Thomas S. Smith, II ,  William G. Kozak ,  Lisa K. Miller ,  Eric C. Kuhns

IPC分类号： C09D5/00 ,  C09D153/00 ,  C09D135/02 ,  C09D109/02 ,  C09D4/06 ,  C09D7/20 ,  C09D7/65 ,  H05K3/28

摘要： A circuit board water-proofing coating composition is provided comprising: at least one passivating agent, preferably containing a molecule comprising a thio-functional group, desirably a thiol group, an azolic moiety, or an azole, and combinations thereof; at least one binder component comprising an organic or inorganic film-forming polymer, and/or one or more polymer pre-cursors polymerizable on a substrate surface; and optionally one or more additive(s); also provided are methods of making and using the coating composition and coated circuit boards.

公开(公告)号：US12110413B2

公开(公告)日：2024-10-08

申请号：US17448404

申请日：2021-09-22

申请人： Henkel AG & Co. KGaA

发明人： John L. Zimmerman ,  John D. McGee ,  Gregory T. Donaldson ,  Thomas S. Smith, II ,  William G. Kozak ,  Lisa K. Miller ,  Eric C. Kuhns

IPC分类号： C09D7/65 ,  C09D4/06 ,  C09D5/00 ,  C09D7/20 ,  C09D109/02 ,  C09D135/02 ,  C09D153/00 ,  H05K3/28

CPC分类号： C09D5/00 ,  C09D4/06 ,  C09D7/20 ,  C09D7/65 ,  C09D109/02 ,  C09D135/02 ,  C09D153/00 ,  H05K3/282 ,  H05K3/284

摘要： A circuit board water-proofing coating composition is provided comprising: at least one passivating agent, preferably containing a molecule comprising a thio-functional group, desirably a thiol group, an azolic moiety, or an azole, and combinations thereof; at least one binder component comprising an organic or inorganic film-forming polymer, and/or one or more polymer pre-cursors polymerizable on a substrate surface; and optionally one or more additive(s); also provided are methods of making and using the coating composition and coated circuit boards.

公开(公告)号：US11535940B2

公开(公告)日：2022-12-27

申请号：US16275677

申请日：2019-02-14

申请人： Henkel AG & Co. KGaA

发明人： Thomas Moeller ,  Kristof Wapner ,  Juergen Stodt ,  Natascha Henze ,  Kevin D. Murnaghan ,  Ralf Posner ,  Jan-Willem Brouwer ,  Thomas S. Smith, II ,  Donald R. Vonk

IPC分类号： C23C22/34

摘要： The invention relates to use of an adhesion promoting organic compound comprising at least one tertiary amine group, bonded via a bridge-constituting divalent radical, with the carbonyl carbon atom of an amide group, wherein the bridge-constituting divalent radical comprises two carbon atoms as bridge atoms, for anticorrosion pretreatment of metallic materials before painting and to aqueous compositions containing the adhesion promoting organic compound which generate conversion layers based on the elements Zr, Ti and/or Si. The present invention further comprises a process for anticorrosion coating of components at least partly manufactured from metallic materials comprising a pretreatment using acidic aqueous compositions according to the invention and subsequent painting. In a further aspect, the invention relates to a metallic substrate having a mixed organic/inorganic coating consisting of oxides, hydroxides and/or oxyfluorides of the elements Zr, Ti and/or Si and of the adhesion promoting organic compounds.

公开(公告)号：US20190177853A1

公开(公告)日：2019-06-13

申请号：US16275677

申请日：2019-02-14

申请人： Henkel AG & Co. KGaA

发明人： Thomas Moeller ,  Kristof Wapner ,  Juergen Stodt ,  Natascha Henze ,  Kevin D. Murnaghan ,  Ralf Posner ,  Jan-Willem Brouwer ,  Thomas S. Smith, II ,  Donald R. Vonk

IPC分类号： C23C22/34

摘要： The invention relates to use of an adhesion promoting organic compound comprising at least one tertiary amine group, bonded via a bridge-constituting divalent radical, with the carbonyl carbon atom of an amide group, wherein the bridge-constituting divalent radical comprises two carbon atoms as bridge atoms, for anticorrosion pretreatment of metallic materials before painting and to aqueous compositions containing the adhesion promoting organic compound which generate conversion layers based on the elements Zr, Ti and/or Si. The present invention further comprises a process for anticorrosion coating of components at least partly manufactured from metallic materials comprising a pretreatment using acidic aqueous compositions according to the invention and subsequent painting. In a further aspect, the invention relates to a metallic substrate having a mixed organic/inorganic coating consisting of oxides, hydroxides and/or oxyfluorides of the elements Zr, Ti and/or Si and of the adhesion promoting organic compounds.

公开(公告)号：US09896594B2

公开(公告)日：2018-02-20

申请号：US14507966

申请日：2014-10-07

申请人： Henkel AG & Co. KGaA

发明人： Brian D. Bammel ,  Thomas S. Smith, II

IPC分类号： C09D133/04 ,  C08F8/30 ,  C09D191/06 ,  C08K3/30 ,  C08K5/41

CPC分类号： C09D133/04 ,  C08F8/30 ,  C08F2800/20 ,  C08F2810/20 ,  C08K3/30 ,  C08K5/41 ,  C09D191/06 ,  Y10T428/273 ,  Y10T428/31688 ,  Y10T428/31699 ,  C08F8/00 ,  C08F220/14

摘要： Disclosed is cross-linking process for cross-linking polymeric chains in a coating composition. In one embodiment the process utilizes a Hantzsch dihydropyridine reaction to form reaction products including cross-linking polymeric resin chains having beta-keto ester functions using a source of aldehyde and a source of ammonia or a primary amine to form a permanent dihydropyridine bond between the beta-keto ester functions. The novel cross-linking reaction can occur at lower temperatures compared to typical cross-linking reactions and can occur in aqueous solutions that have a neutral to mildly alkaline pH of from 6 to 11. The novel cross-linking reaction provides many advantages to performing cross-linking of polymeric chains in coating resins.

公开(公告)号：US20210309880A1

公开(公告)日：2021-10-07

申请号：US17352434

申请日：2021-06-21

申请人： Henkel AG & Co. KGaA

发明人： Thomas S. Smith, II ,  John L. Zimmerman ,  John D. McGee ,  Gregory T. Donaldson ,  Lisa K. Miller ,  William G. Kozak ,  Eric C. Kuhns

IPC分类号： C09D133/14 ,  C08F120/20 ,  H05K3/28

摘要： Disclosed is a process that utilizes a modified Atom Transfer Radical Polymerization (ATRP) process to form a water-resistant coating in situ on a substrate. The process uses solvent soluble monomers, initiator and ligand to form a solvent insoluble water-resistant polymer coating that is deposited directly onto a metal trace on the substrate. The process is especially useful for providing a water-resistant coating to the circuits on a printed circuit board, wearable electronics, and biological sensors. The process can be run in an aqueous solvent in the open atmosphere and does not require a vacuum, heating steps or masking. The coating is deposited only on the metal trace and closely adjacent areas of the substrate.