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    Rectangular helical core geometry for heat exchanger
    1.
    发明授权
    Rectangular helical core geometry for heat exchanger 有权

    公开(公告)号：US11359864B2

    公开(公告)日：2022-06-14

    申请号：US16711113

    申请日：2019-12-11

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Ahmet T. Becene ,  Gabriel Ruiz ,  Feng Feng ,  Michael Maynard ,  Michael Doe ,  Michele Hu ,  Ephraim Joseph

    IPC: F28D1/047 ,  F28D1/02

    Abstract: A heat exchanger includes a first fluid manifold extending along a first fluid axis from a first fluid inlet to a first fluid outlet. The first fluid manifold comprises a inlet header, a outlet header, and a multi-helical core section. The inlet header is disposed to fork the first fluid inlet into a plurality of first fluid branches distributed laterally across a plane normal to the first fluid axis. The outlet header is disposed to combine the plurality of first fluid branches into the first fluid outlet. The multi-helical core section fluidly connects the inlet header to the outlet header via a plurality of laterally distributed helical tubes, each helical tube corresponding to one of the plurality of first fluid branches and oriented parallel to all others of the plurality of helical tubes at each axial location along the first fluid axis.

    LEAF-SHAPED GEOMETRY FOR HEAT EXCHANGER CORE
    3.
    发明申请
    LEAF-SHAPED GEOMETRY FOR HEAT EXCHANGER CORE 审中-公开

    公开(公告)号：US20200263928A1

    公开(公告)日：2020-08-20

    申请号：US16711144

    申请日：2019-12-11

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Ephraim Joseph ,  Michael Maynard ,  Michael Doe ,  Michele Hu ,  Feng Feng ,  Ahmet T. Becene ,  Gabriel Ruiz

    IPC: F28D1/02 ,  F28D1/047 ,  F28D1/053

    Abstract: A core arrangement for a heat exchanger includes a first core layer disposed along a first plane and having an inlet and outlet oriented along a first axis within the first plane and a first core stage disposed in fluid communication between the inlet and the outlet. The first core stage includes a first upstream fluid intersection downstream of and adjacent the inlet and having a first inlet continuation and a first bifurcation. The first core stage further includes a first downstream fluid intersection upstream of and adjacent the outlet and having a first outlet continuation and a first recombination. A plurality of first core tubes fluidly connect the first bifurcation to the first recombination. The first core layer further includes a second core stage disposed in fluid communication between the first inlet continuation and the first outlet continuation. The second core stage includes a second upstream fluid intersection downstream of the first inlet continuation and having a second bifurcation, and a second downstream fluid intersection upstream of the first outlet continuation and having a second recombination. A plurality of independent second core tubes fluidly connect the second bifurcation to the second recombination.

    CURVED HEAT EXCHANGER
    6.
    发明申请
    CURVED HEAT EXCHANGER 审中-公开

    公开(公告)号：US20200318910A1

    公开(公告)日：2020-10-08

    申请号：US16378063

    申请日：2019-04-08

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Gabriel Ruiz ,  Michael Maynard ,  Michael Doe ,  Michele Hu ,  Ahmet T. Becene ,  Feng Feng

    IPC: F28D1/047 ,  F01D25/12

    Abstract: A heat exchanger system is disclosed herein that extends between a first component and a second component. The heat exchanger system includes a hot flow path configured to convey hot fluid between the first component and the second component, a cool flow path configured to convey cool fluid, and a heat exchanger located between the first component and the second component along the hot flow path and the cool flow path. The heat exchanger includes at least one curve to accommodate the hot flow path and is configured to reduce the temperature of the hot fluid by allowing the transfer of thermal energy from the hot fluid to the cool fluid.

    DDR electronic module assembly
    7.
    发明授权
    DDR electronic module assembly 有权

    公开(公告)号：US10306751B2

    公开(公告)日：2019-05-28

    申请号：US15788862

    申请日：2017-10-20

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Jason C. Duffy ,  James A. Gosse ,  Shun-Tien Lin ,  Michael Maynard ,  An Nguyen

    IPC: H05K5/00 ,  H05K1/02 ,  H01R12/71 ,  H05K1/18 ,  H05K1/14

    Abstract: An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.

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