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    THERMAL MANAGEMENT SYSTEMS FOR RECTIFIER ASSEMBLIES
    1.
    发明申请
    THERMAL MANAGEMENT SYSTEMS FOR RECTIFIER ASSEMBLIES 有权

    公开(公告)号：US20250024650A1

    公开(公告)日：2025-01-16

    申请号：US18220676

    申请日：2023-07-11

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Ashutosh Joshi ,  Eric A. Carter ,  Coralyn J. Saxby ,  Debabrata Pal

    IPC: H05K7/20 ,  H02G5/10 ,  H02M7/00

    Abstract: In accordance with at least one aspect of this disclosure, a rectifier assembly includes, at least, a first diode disposed between a first bus bar and a second bus bar. The rectifier assembly further includes, a first thermal management structure and a second thermal management structure. The first thermal management structure is configured to electrically connect the first bus bar to the first diode and be in thermal communication between the first bus bar and a first side of the first diode to transfer heat between the first bus bar and the first diode. The first thermal management structure is configured to transfer heat between the first bus bar and the first thermal management structure. The first thermal management structure is also configured to allow a fluid to flow therethrough to transfer heat from the first thermal management structure to the fluid flowing therethrough.

    COOLING FOR POWER DISTRIBUTION SYSTEMS
    2.
    发明公开
    COOLING FOR POWER DISTRIBUTION SYSTEMS 审中-公开

    公开(公告)号：US20230371216A1

    公开(公告)日：2023-11-16

    申请号：US17744668

    申请日：2022-05-14

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Debabrata Pal ,  Eric A. Carter ,  Scott R. Bouras

    IPC: H05K7/20 ,  H05K5/06

    CPC classification number: H05K7/209 ,  H05K7/20409 ,  H05K5/06

    Abstract: In accordance with at least one aspect of this disclosure, a power distribution system having integrated cooling includes a chassis defining an interior cavity, an electronics bus structure housed within the interior cavity, and an electrical contactor operatively connected to the electronics bus structure to receive a voltage therefrom. One or more heat dissipation fins can be included extending away from the chassis and configured to dissipate heat from the electronics bus structure to an ambient environment external to the chassis. In embodiments, the electronics bus structure can be sealed within the interior cavity.

    SYSTEMS AND METHODS FOR THERMAL CONTROL OF A GENERATOR CONTROL UNIT
    3.
    发明申请
    SYSTEMS AND METHODS FOR THERMAL CONTROL OF A GENERATOR CONTROL UNIT 有权

    公开(公告)号：US20210378087A1

    公开(公告)日：2021-12-02

    申请号：US17332392

    申请日：2021-05-27

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Steven E. Larson ,  Eric A. Carter ,  Ethan Johnson

    IPC: H05K1/02 ,  H05K1/11

    Abstract: A generator control unit (GCU) having thermal control includes a GCU housing having a first side and a second side. A printed wiring board (PWB) is within the GCU housing between the first side and the second side. The PWB includes a component side that faces a first side of the GCU housing. At least one through via is positioned through a thickness of the PWB. At least one boss is positioned on the component side of the PWB. The at least one boss extends from a component of the PWB to the first side of the GCU housing.

    HYBRID THERMAL MANAGEMENT OF ELECTRONICS
    5.
    发明申请
    HYBRID THERMAL MANAGEMENT OF ELECTRONICS 有权

    公开(公告)号：US20210050138A1

    公开(公告)日：2021-02-18

    申请号：US16542917

    申请日：2019-08-16

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Debabrata Pal ,  Ashutosh Joshi ,  Mark W. Metzler ,  Eric A. Carter

    IPC: H01F27/12 ,  H01F27/28 ,  H01F27/24 ,  H01F27/02

    Abstract: A transformer assembly includes a housing, a core within an interior of the housing, and at least one winding positioned around the core. The at least one winding and the core are mounted to the housing with potting material. At least a portion of a fluid circuit is defined within at least one wall of the housing. The at least the portion of the fluid circuit is defined through an opening in the at least one wall of the housing in fluid communication with the interior of the housing. A transformer assembly includes a housing, a core within an interior of the housing, at least one winding positioned around the core, and a fluid circuit defined at least partially within at least one wall of the housing being configured such that heat is transferred to the fluid from at least one of the core and the at least one winding.

    Dual sourced common 3-level VSCF
    7.
    发明授权
    Dual sourced common 3-level VSCF 有权

    公开(公告)号：US11611287B2

    公开(公告)日：2023-03-21

    申请号：US17173070

    申请日：2021-02-10

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Dwight D. Schmitt ,  Mustansir Kheraluwala ,  Eric A. Carter

    IPC: H02M7/08 ,  H02M5/458 ,  H02M1/08 ,  H02M1/00

    Abstract: A system comprises a first 3-phase rectifier having a positive DC lead and a negative DC lead and a second 3-phase rectifier having a positive DC lead and a negative DC lead. The system also includes a 4-phase, 3-level inverter connected to the first and second 3-phase rectifiers. A method comprises receiving variable frequency, 3-phase power from a first generator, receiving variable frequency, 3-phase power from a second generator, rectifying the variable frequency, 3-phase power from each of the first and second generators into DC power. And inverting the DC power into 4-phase, constant frequency power for powering a load.

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