- 专利标题: HYBRID THERMAL MANAGEMENT OF ELECTRONICS
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申请号: US16542917申请日: 2019-08-16
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公开(公告)号: US20210050138A1公开(公告)日: 2021-02-18
- 发明人: Debabrata Pal , Ashutosh Joshi , Mark W. Metzler , Eric A. Carter
- 申请人: Hamilton Sundstrand Corporation
- 申请人地址: US NC Charlotte
- 专利权人: Hamilton Sundstrand Corporation
- 当前专利权人: Hamilton Sundstrand Corporation
- 当前专利权人地址: US NC Charlotte
- 主分类号: H01F27/12
- IPC分类号: H01F27/12 ; H01F27/28 ; H01F27/24 ; H01F27/02
摘要:
A transformer assembly includes a housing, a core within an interior of the housing, and at least one winding positioned around the core. The at least one winding and the core are mounted to the housing with potting material. At least a portion of a fluid circuit is defined within at least one wall of the housing. The at least the portion of the fluid circuit is defined through an opening in the at least one wall of the housing in fluid communication with the interior of the housing. A transformer assembly includes a housing, a core within an interior of the housing, at least one winding positioned around the core, and a fluid circuit defined at least partially within at least one wall of the housing being configured such that heat is transferred to the fluid from at least one of the core and the at least one winding.
公开/授权文献
- US11482368B2 Hybrid thermal management of electronics 公开/授权日:2022-10-25
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