公开(公告)号：US20130112853A1

公开(公告)日：2013-05-09

申请号：US13666098

申请日：2012-11-01

申请人： Hamamatsu Photonics K.K.

发明人： Motohiro SUYAMA ,  Akiomi UJIMA ,  Kentaro MAETA ,  Hisanori SUZUKI ,  Masaharu MURAMATSU ,  Fumio IWASE

IPC分类号： H01L27/148

CPC分类号： H01L27/14843 ,  H04N3/1525 ,  H04N3/1537 ,  H04N5/3722

摘要： A solid-state imaging device 1A includes a CCD-type solid-state imaging element 10 having an imaging plane 12 formed of M×N pixels that are two-dimensionally arrayed in M rows and N columns, N signal readout circuits 20 arranged on one end side in the column direction for each of the columns with respect to the imaging plane 12, and N signal readout circuits 30 arranged on the other end side in the column direction for each of the columns with respect to the imaging plane 12, a semiconductor element 50 for digital-converting and then sequentially outputting as serial signals electrical signals output from the signal readout circuits 20 for each of the columns, and a semiconductor element 60 for digital-converting and then sequentially outputting as serial signals electrical signals output from the signal readout circuits 30 for each of the columns.

摘要翻译： 固态成像装置1A包括CCD型固体摄像元件10，其具有由M×N个像素形成的成像面12，二维排列成M行N列，N个信号读出电路20配置在一个 相对于成像面12的各列的列方向的端侧，以及相对于摄像面12对于列的列方向配置在另一端侧的N个信号读出电路30，半导体 元件50，用于数字转换，然后顺序地输出作为串行信号从每个列的信号读出电路20输出的电信号;以及半导体元件60，用于数字转换，然后顺序地输出作为串行信号从信号输出的电信号 每列的读出电路30。

公开(公告)号：US20130107097A1

公开(公告)日：2013-05-02

申请号：US13666149

申请日：2012-11-01

申请人： Hamamatsu Photonics K.K.

发明人： Motohiro SUYAMA ,  Akiomi UJIMA ,  Kentaro MAETA ,  Hisanori SUZUKI ,  Masaharu MURAMATSU ,  Fumio IWASE

IPC分类号： H04N5/335

CPC分类号： H01L27/14618 ,  H01L2224/16 ,  H01L2224/48091 ,  H04N5/2253 ,  H01L2924/00014

摘要： A solid-state imaging device 2A includes a CCD-type solid-state imaging element 10 having an imaging plane 12 formed of M×N pixels that are two-dimensionally arrayed in M rows and N columns and N signal readout circuits 20 arranged on one end side in the column direction for each of the columns with respect to the plane 12 and for outputting electrical signals according to the magnitudes of charges taken out of the respective columns, respectively, a C-MOS-type semiconductor element 50 for digital-converting and sequentially outputting as serial signals electrical signals output from the circuits 20 for each of the columns, a heat transfer member 80 having a main surface 81a and a back surface 81b, and a cooling block 84 provided on the surface 81b, and the semiconductor element 50 and the surface 81a of the heat transfer member 80 are bonded to each other.

摘要翻译： 固态成像装置2A包括CCD型固体摄像元件10，该CCD型固体摄像元件10具有由M×N像素构成的摄像面12，二维排列成M行N列，N信号读出电路20配置在一方 用于每个列相对于平面12的列方向的端侧，并分别根据从各列取出的电荷的大小输出电信号，用于数字转换的C-MOS型半导体元件 并顺序地输出作为串行信号从每个列的电路20输出的电信号，具有主表面81a和后表面81b的传热构件80和设置在表面81b上的冷却块84，以及半导体元件 50和传热构件80的表面81a彼此接合。