摘要:
A method for fabricating a semiconductor device includes forming an inter-layer insulation layer on a substrate; forming openings in the inter-layer insulation layer; forming a metal barrier layer in the openings and on the inter-layer insulation layer; forming a first conductive layer on the metal barrier layer and filled in the openings; etching the first conductive layer to form interconnection layers in the openings and to expose portions of the metal barrier layer, the interconnection layers being inside the openings and at a depth from a top of the openings; etching the exposed portions of the metal barrier layer to obtain a sloped profile of the metal barrier layer at top lateral portions of the openings; forming a second conductive layer over the inter-layer insulation layer, the interconnection layers and the metal barrier layer with the sloped profile; and patterning the second conductive layer to form metal lines.
摘要:
A method for fabricating a semiconductor device includes forming an inter-layer insulation layer on a substrate; forming openings in the inter-layer insulation layer; forming a metal barrier layer in the openings and on the inter-layer insulation layer; forming a first conductive layer on the metal barrier layer and filled in the openings; etching the first conductive layer to form interconnection layers in the openings and to expose portions of the metal barrier layer, the interconnection layers being inside the openings and at a depth from a top of the openings; etching the exposed portions of the metal barrier layer to obtain a sloped profile of the metal barrier layer at top lateral portions of the openings; forming a second conductive layer over the inter-layer insulation layer, the interconnection layers and the metal barrier layer with the sloped profile; and patterning the second conductive layer to form metal lines.
摘要:
A method for fabricating a semiconductor device includes forming an inter-layer insulation layer on a substrate; forming openings in the inter-layer insulation layer; forming a metal barrier layer in the openings and on the inter-layer insulation layer; forming a first conductive layer on the metal barrier layer and filled in the openings; etching the first conductive layer to form interconnection layers in the openings and to expose portions of the metal barrier layer, the interconnection layers being inside the openings and at a depth from a top of the openings; etching the exposed portions of the metal barrier layer to obtain a sloped profile of the metal barrier layer at top lateral portions of the openings; forming a second conductive layer over the inter-layer insulation layer, the interconnection layers and the metal barrier layer with the sloped profile; and patterning the second conductive layer to form metal lines.
摘要:
A method for fabricating a semiconductor device includes forming an inter-layer insulation layer on a substrate; forming openings in the inter-layer insulation layer; forming a metal barrier layer in the openings and on the inter-layer insulation layer; forming a first conductive layer on the metal barrier layer and filled in the openings; etching the first conductive layer to form interconnection layers in the openings and to expose portions of the metal barrier layer, the interconnection layers being inside the openings and at a depth from a top of the openings; etching the exposed portions of the metal barrier layer to obtain a sloped profile of the metal barrier layer at top lateral portions of the openings; forming a second conductive layer over the inter-layer insulation layer, the interconnection layers and the metal barrier layer with the sloped profile; and patterning the second conductive layer to form metal lines.
摘要:
A method for fabricating a semiconductor device includes forming a hard mask pattern over a substrate, forming a first recess in the substrate and a passivation layer on sidewalls of the first recess using the hard mask pattern as an etch barrier, and forming a second recess by etching a bottom portion of the first recess using the passivation layer as an etch barrier, wherein a width of the second recess is greater than that of the first recess.
摘要:
A plasma display apparatus includes: an electrode of a discharge cell; a first transistor having a first terminal and a second terminal, the second terminal being connected to the electrode; a first capacitor having a first terminal to receive a control signal having either a low level voltage or a high level voltage; a push-pull circuit including a first power terminal, a second power terminal connected to the first terminal of the first transistor, an input terminal connected to a second terminal of the first capacitor, and an output terminal connected to a gate of the first transistor, the push-pull circuit outputting either a voltage of the first power terminal or a voltage of the second power terminal to the output terminal; a floating power source having a positive terminal connected to the first power terminal and a negative terminal connected to the second power terminal; and a first diode connected between the first terminal of the first transistor and the second terminal of the first capacitor.
摘要:
A protective layer of a plasma display panel includes smoky magnesium oxide, the smoky magnesium oxide having single crystal magnesium oxide with a plurality of cavities therein.
摘要:
In a plasma display, a first electrode and a second electrode of a transistor may be respectively coupled to a scan electrode and a power source for supplying a scan voltage. The plasma display may include a scan electrode, a first transistor, a first resistor, and a second resistor. The first transistor may include a first electrode electrically coupled to the scan electrode, a second electrode electrically coupled to the power source and a control electrode. The first resistor may be electrically coupled between the scan electrode and the control electrode of the first transistor. The second resistor may be electrically coupled between the control electrode of the transistor and the power source.
摘要:
A protecting layer is formed of a magnesium oxide and at least one additional component selected from the group consisting of a copper component selected from copper and a copper oxide, a nickel component selected from nickel and a nickel oxide, a cobalt component selected from cobalt and a cobalt oxide, and an iron component selected from iron and an iron oxide; a composite for forming the protecting layer; a method of forming the protecting layer; and a plasma display panel including the protecting layer. The protecting layer, which is used in a PDP, protects an electrode and a dielectric layer from a plasma ion generated by a gaseous mixture of Ne and Xe, or He, Ne, and Xe, and discharge delay time and dependency of the discharge delay time on temperature can be decreased and sputtering resistance can be increased.
摘要:
A plasma display device and method of driving the device is disclosed. The device includes a driving circuit for driving reset, address, and sustain periods during a subfield of a frame. The driving circuit includes a single switch which is used to drive a display electrode both during the reset period and during the sustain period. The switch being used for both periods removes the need for a second switch, thereby reducing manufacturing and design costs.